Indium Corporation will feature its innovative products for advanced packaging at Electronic Components and Technology Conference (ECTC), May 31-June 3, in San Diego, Calif., U.S.As advanced packaging techniques continue to evolve within the industry, it is necessary that materials be able... Read More
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will debut the Dual-Mode Multi-Reflection Suppression® (MRS®) sensor-enabled SE3000™ SPI system in Hall 4A, Stand 210 at SMTconnect, scheduled to take place May 10-12,... Read More
SMT (Surface Mount Technology) is gaining popularity for creating robust PCB assemblies among electronics manufacturers in order to meet requirements in various industries. The use of SMT lines in the manufacture of functional medical equipment and several other automotive electronics is propelling ... Read More
Universal Instruments held a ribbon-cutting ceremony for Binghamton University’s acceptance of the company’s High-Speed Wafer Feeder (HSWF) on April 5 at Universal’s corporate headquarters in Conklin, NY. The ceremony included representatives from Universal, Binghamton University a... Read More
AT&S has announced that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to excellence, partnership, inclusion, and continuous quality improvement, AT&S has achieved a level of performance that consistently exceeds Intel’s expectations.“As one... Read More
ICAPE Group has announced the acquisition of German PCB supplier SAFA2000. Germany is an important country for ICAPE Group in terms of sales and this move follows massive investments in Germany with a brand-new facility and an advanced logistics center.Founded the same year as ICAPE Group in 1999, S... Read More
KATEK SE has signed a comprehensive, exclusive term sheet with SigmaPoint Technologies in Cornwall, Canada, for the acquisition of all shares in the Canadian company. The negotiation of the associated share purchase agreement should be concluded shortly with the closing planned for the end of Q2 at ... Read More
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be participating at SMTconnect 2022 in Nuremberg, Germany, from 10-12 May. Visitors are invited to Saki’s booth 135 in Hall 4A to see the latest inspection solution upgrades of the compan... Read More
KIC, the thermal process experts who make ovens smarter, will showcase its Reflow Process Inspection (RPI) and Wave Process Inspection (WPI) at SMTconnect in Hall 4, Stand 452 on May 10-12, 2022 in Nuremberg. Along with RPI and WPI, the KIC team will discuss NPI setup, process a... Read More
New data from IPC show that the electronics manufacturing supply chain is already feeling the impact of the Russia-Ukraine War.IPC’s April Monthly Economic Update and Global Sentiment Survey found that four-fifths of manufacturers expect the war to have a negative impact on commodity pric... Read More
KLA Corporation has announced the launch of Frontline Cloud Services, a software solution that accelerates design-for-manufacturability (DFM) analysis and time-to-market (TTM) for complex printed circuit boards (PCBs). Advanced technologies, such as 5G and miniLED, call for PCBs with increasingly co... Read More
Teledyne DALSA, a Teledyne Technologies company, has announced the release of its multispectral Camera Link HS (CLHS) line scan camera—a new model of the award-winning Linea product line. This latest high-resolution line scan camera provides spectrally independent RGB and NIR outputs making it... Read More
Hentec Industries/RPS Automation has announced that it will exhibit its full line of selective soldering, component lead tinning, and solderability test equipment at the upcoming SMTA Huntsville Expo & Tech Forum to be held at the Jackson Center, in Huntsville, Alabama on April 12, 2022.At the S... Read More
MacDermid Alpha will feature the recently launched ALPHA OM-565 HRL3 low-temperature solder paste at the SMTA Huntsville Expo & Tech Forum to be held at the Jackson Center on April 12, 2022. ALPHA OM-565 HRL3 is formulated for a broad range of assemblies to mitigate warpage-induced defects in te... Read More
Test Research Inc., has announced the launch of the high-density pin count In-Circuit Tester (ICT) TR8100H SII with vacuum fixture for full coverage testing. The TR8100H SII is the latest high-performance board test system targeting the low-voltage testing market, as well as for large and complex PC... Read More
YINCAE, a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials, has announced that it has developed DA 158N die-attach materials which are thermally conductive and electrical insulating adhesives. It can be fast cured at low temperatures and can be used... Read More
NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, announced that it has generated $17 million in funding (including $8.7M in cost-share contribution from participants) for 18 new projects as part of its Project Call 6.0 to further promote FHE development and a... Read More
IPC is now accepting abstracts for technical paper presentations, technical posters, and professional development courses for IPC APEX EXPO 2023. The technical conference will be held January 21-26, 2023, and professional development courses will take place January 24-26, 2023, at the San Diego Conv... Read More
Lawrence Berkeley National Laboratory (Berkeley Lab) has developed a compact, robust, and low-cost method for interconnecting printed circuit boards (PCBs) without requiring soldering or additional components. These narrow board-in-board connectors can handle higher voltages and mechanical stresses ... Read More
Benchmark Electronics, a global provider of engineering, design, and manufacturing services has announced that it has been selected by Dynetics, a wholly-owned subsidiary of Leidos, to manufacture electronic components for the company's Enduring Shield mobile ground-based weapon system. Enduring... Read More
Explain your requirement *
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR