MacDermid Alpha to Feature New Versatile Low Temperature Solder Paste at SMTA Expo & Tech Forum

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MacDermid Alpha will feature the recently launched ALPHA OM-565 HRL3 low-temperature solder paste at the SMTA Huntsville Expo & Tech Forum to be held at the Jackson Center on April 12, 2022. ALPHA OM-565 HRL3 is formulated for a broad range of assemblies to mitigate warpage-induced defects in temperature-sensitive chip-scale packages. The ALPHA OM-565 chemistry enhances thermomechanical performance over existing low-temperature solders, including excellent compatibility when used in combination with other tested assembly products, such as rework fluxes and cored solder wires.

“ALPHA OM-565 HRL3 alloy is our latest low-temperature solder (LTS) paste and is an important addition to our LTS portfolio of solutions offering,” said Scott Lewin, Regional Marketing Manager. “Not only does it minimize post-reflow defects such as non-wet opens and head-in-pillow, but it also provides similar thermal cycling and drop shock performance to SAC305 at its target operating temperature range of -40 up to 85 °C. All this at a peak reflow temperature of only 175 °C! Because of this lower peak temperature requirement, ALPHA OM-565 also lowers overall energy consumption contributing to the industry’s efforts at increased sustainability.”

In addition, the high-reliability solutions portfolio including ALPHA CVP-390V and Kester NP505-HR solder pastes with Innolot alloy and the ALPHA HiTech series of adhesive, edgebond, and underfill will be promoted. These materials are designed for a wide range of applications to provide exceptional performance in the harshest of environments.

Click here to learn more about the ALPHA OM-565 HRL3 solder paste.