Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology. Durafuse HR is a patent-pending alloy system that delivers enhanced thermal cycling performance and superior voiding performan... Read More
Indium Corporation will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium (IMS) 2024, Washington, D.C., June 18-20 (booth #214 at the show).Indium Corporation is ... Read More
MacDermid Alpha, a leading provider of advanced materials and solutions for electronics assembly, announces its participation in PCIM Europe 2024, scheduled from June 11 to June 13, 2024.At PCIM Europe 2024, MacDermid Alpha will unveil its latest breakthrough product, Argomax Acculam, designed for s... Read More
With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly us... Read More
Since 1967, Hardmeier Electronics AG has been developing and producing innovative electronic devices and systems for measurement, control, and regulation technology. Within the Hardmeier Holding, comprising Hardmeier Electronics AG and Regatron AG, the company possesses high level of R&D an... Read More
According to a new market research report titled, 'Additive Manufacturing Market Size, Share, Forecast, & Trends Analysis – Global Forecast to 2031,' the additive manufacturing market is expected to be worth $93.36 billion by 2031, at a CAGR of 20.3% from 2024 to 2031.Additive manu... Read More
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advance... Read More
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Ontario Expo & Tech Forum taking place on June 11 at Venu Event Space om Vaughan, Ontario, Canada. Among other great products, AIM wi... Read More
Sentiment among electronics manufacturers fell this month, after hitting a new high in April. Despite the decline, sentiment remains historically high according to IPC's May Sentiment of the Global Electronics Manufacturing Supply Chain Report.When asked about PCB and EMS sales revenue growth/de... Read More
DuPont today announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power, and thermal management, DuPont will exhibit at ... Read More
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the ... Read More
Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA. Payne’s presentation, scheduled for May 9, will examine the challenges and benefits of ... Read More
IPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.Arlon produces and sells military-grade, cop... Read More
MacDermid Alpha Electronics Solutions has introduced the ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. In the rapidly evolving electronics industry, where innovation drives progr... Read More
IDTechEx has unveiled the report titled "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets", which analyzes the technologies and market trends that promise to bring electronics manufacturing into the 3D realm. Drawing from over 30 company profiles, the repor... Read More
Apollo Seiko, a leading innovator in soldering technology, will exhibit at the SMTA Wisconsin Expo, scheduled to take place Tuesday, May 7, 2024, at the Four Points by Sheraton | Milwaukee Airport. The company will showcase its JCAT Lyra soldering system with the ARC 5000.The ARC 5000 introduces an ... Read More
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Juarez Expo & Tech Forum taking place on May 9 at the Electronic Convention Center in Ciudad Juarez, Chihuahua, Mexico. Among other g... Read More
IDTechEx has released a report titled "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications." Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as sma... Read More
IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets". This IDTechEx report assesses the competing technologies that will enable PCBs to be re... Read More
DuPont introduced the DuPont Pyralux ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux laminates for flexible and rigid-flex printed circuit boards (PCBs). Developed for optimal thermal management, these laminates are an ideal solution for high-reli... Read More
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