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PCB Equipment Digest: New and Interesting Products

11 June, 2026 Newsletter - PCB Directory

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Equipment Digest
Date: 11 June, 2026
 
Sponsored by IPCA Expo 2026
 
 
New and Interesting Equipment
Flying Probe Tester
Automated Two-Pin Flying Probe Tester
Flying Probe Tester  from Huntron
The Huntron ® Access HF Prober from Huntron is an Automated Flying Probe Tester that has a unique rotating probe head with two test pins. It is a high-frequency desktop robotic platform that captures HF measurements on a stimulated CCA and eliminates errors in probe placement and the need for documentation that identifies the physical location of the probe points. This equipment has a probing area of 53.34 x 38.1 cm and a pin spacing of 0.039 to 0.9 inches.
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Reflow Soldering Equipment
Portable Reflow Oven for Lead/Lead-Free Solder Pastes and Adhesives
Reflow Soldering Equipment  from SMTmax Corp
The AS-6070 from SMTmax is a Portable Reflow Oven that can be used for adhesives, lead solder, or lead-free solder paste. It has an infrared radiation heating system with hot air circulation using two fans internally to provide an even distribution of heat. This oven has four automatic soldering modes preset that cover most solder pastes, and also enables setting up a custom temperature program. Its reflowing process is automatically controlled by the internal microprocessor, and it has an LCD screen that displays real-time temperature.
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Pick and Place Machine
Pick and Place Machine with Placement Speed of up to 93,000 CPH
Pick and Place Machine  from ASMPT GmbH & Co. KG SMT Solutions
The SIPLACE TX2i micron from ASMPT GmbH & Co. KG is a Pick and Place Machine that has a placement speed of up to 93,000 CPH. It has an accuracy of up to ±10 µm @ 3 σ and can handle PCB dimensions of up to 375 x 460 mm (single-lane mode), 375 x 260 mm (dual lane mode) & 590 x 460 mm (long board). This machine supports two different placement heads - the CP20 for components ranging from 0.6 x 0.3 mm (0201) to 8.2 x 8.2 x 4 mm and the CPP for components ranging from 0.4 x 0.2 mm (0402) to 27 x 27 x 6 mm.
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Buffer Equipment
Buffer Equipment for SPI/AOI Processes
Buffer Equipment  from Advanced Mechatronics Solutions, Inc
The KGNB-700L from Advanced Mechatronics Solutions, Inc. is a Buffer Equipment that is designed to sort PCBs into NG ("No Good" or faulty) and good PCBs in PCB production. It stores the NG PCBs in the rack after the SPI/AOI process, while transferring good PCBs to the next machine in a FIFO or LIFO way. This equipment can handle PCB sizes ranging from 50 x 50 mm to 530 x 380 mm and can load up to 15 or 20 boards at a time.
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Solder Paste Inspection Equipment
Solder Paste Inspection Machine for PCB Sizes from 50 x 50 mm to 510 x 590 mm
Solder Paste Inspection Equipment  from Juki Americas
The RV-1 from JUKI is a Solder Paste Inspection Equipment that is designed for high-speed and high-precision inspection of PCB sizes from 50 x 50 mm (dual lane) to 510 x 300 mm (single lane) on SMT production lines. It is based on JUKI’s advanced Clear Vision Capturing System with large-sized ring and coaxial lighting to capture highly detailed inspection images with improved clarity and accuracy.
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Wave Soldering Equipment
Ultra Compact, Power Efficient Dual Wave Soldering Machine
Wave Soldering Equipment  from Manncorp
The 16.350 Ultra Compact from Manncorp is a Wave Soldering Equipment that is designed for high-performance through-hole, SMT, and mixed-technology PCB assemblies. It uses a dual-wave soldering system to deliver reliable and high-quality solder joints while ensuring precise process control and operational efficiency. This machine is equipped with a 440 lb titanium solder pot that supports lead-free soldering and minimizes maintenance requirements.
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Sponsored by ICPA Expo 2026
ICPA Expo 2026 – India’s Premier Electronics & PCB Industry Expo
ICPA Expo 2026 – India’s Premier Electronics & PCB Industry Expo
Join India’s premier electronics and PCB industry expo to connect with top manufacturers, suppliers, and buyers. Showcase your innovations, expand your network, and generate high-quality business leads to accelerate growth. Click here to learn more.
Automated Optical Inspection (AOI) Equipment
Multi-Function 2D/3D Automated Optical Inspection (AOI) Equipment
Automated Optical Inspection (AOI) Equipment  from Nordson Corporation
The SQ3000-X from Nordson Corporation is a Multi-Function Automated Optical Inspection (AOI) Equipment designed for high-speed 2D and 3D inspection of SMT and mixed-technology PCB assemblies. It combines Multi-Reflection Suppression (MRS) sensor technology with AI2 image processing techniques to detect defects such as missing components, tombstoning, polarity issues, bridging, lifted leads, insufficient solder, and coplanarity defects.
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Solder Paste Printer
Automatic Inline Screen Printer for PCB Sizes up to 1200 x 500 mm
Solder Paste Printer  from Kayosmt
The KAYO-1200 from KAYO SMT is an Automatic Inline Screen Printer that prints frame sizes of 737 x 370 mm to 1800 x 737 mm. It can accommodate PCB sizes ranging from 80 x 50 mm to 1200 x 500 mm and PCB thicknesses ranging from 0.8 to 6 mm. This equipment has a print speed of 0-200 mm/s and a cycle time of less than 15 s. It requires an AC supply of 220 V and consumes 3.3 kW of power.
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Reflow Soldering Equipment
Reflow Oven for SMT Assembly Process
Reflow Soldering Equipment  from Allpoint Electronics Ltda
The Point Reflow 8 zones from Allpoint Electronics is a Reflow Oven that is designed to solder SMD components onto PCBs as part of the SMT assembly process. It has 8 heating zones (top and bottom), each of length 3000 mm, and 2 cooling zones. This oven can handle PCBs of width up to 450 mm and has a digital control system made with a PLC and a modular circuit for stability and repetitive precision.
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PCB Laminates
Biodegradable and Recyclable PCB Laminate
PCB Laminates  from Jiva Materials Ltd.
The Soluboard from Jiva Materials is a Biodegradable and Recyclable PCB Laminate Material developed as a sustainable alternative to conventional glass-fiber epoxy substrates such as FR-4. It is manufactured using natural fibres, a water-soluble polymer, and a halogen-free flame retardant, enabling it to be processed using standard PCB fabrication techniques while significantly reducing environmental impact.
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Solder Paste
SAC305 and Innolot Alloy Lead-Free, No-Clean Solder Paste
Solder Paste  from MacDermid Alpha Electronics Solutions
The ALPHA OM-377 from MacDermid Alpha Electronics Solutions is a Lead-Free, No-Clean Solder Paste that is composed of SAC305 and Innolot alloys. It has a transfer efficiency of more than 1.33 Cpk and is suitable for print performance down to 100 μm × 150 μm (01005) components, ensuring consistent print volume on complex PCB designs and reliable solderability on brass and nickel surfaces.
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Selective Soldering Machine
Automated Selective Soldering Machine based on Mini-Solder Wave Technology
Selective Soldering Machine  from TM Soldering Solutions
The PHOENIX from TM Soldering Solutions is a Selective Soldering Machine that is based on mini-solder wave technology for exceptional performance and consistency. It holds the PCB stationary while a high-precision XYZ axis mechanism executes the flux and soldering through-hole components on SMT boards, even in close proximity to adjacent components.
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Sponsored by IPCA Expo 2026
 
 
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