https://cdn.pcbdirectory.com/news/PCB_Cover_637862140030449414.jpg712370
Indium Corporation will feature its innovative products for advanced packaging at Electronic Components and Technology Conference (ECTC), May 31-June 3, in San Diego, Calif., U.S.
As advanced packaging techniques continue to evolve within the industry, it is necessary that materials be able to withstand the placement of complex dies into smaller and smaller packages. Indium Corporation works collaboratively with customers and other industry leaders to develop cutting-edge solutions for current and emerging advanced packaging challenges.
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation’s technical experts have developed an industry-proven advanced packaging portfolio designed to provide enhanced reliability in heterogeneous integration and assembly and system-in-package (SiP) applications.
As an industry leader in high-performance liquid metal-based thermal interface materials (TIM), Indium Corporation will also feature selections from its portfolio of innovative high-performance metal TIM solutions. With its portfolio of alloys that are liquid at or near room temperature, Indium Corporation’s liquid metal TIMs are designed to offer superior thermal conductivity for both TIM0 and TIM1 applications.
Solder paste solutions to be featured include:
Flux solutions to be featured include:
NC-809, a halogen-free, ultra-low residue, flip-chip flux designed to hold die or solder spheres in place without risk of die shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes.
Indium Corporation also offers a wide array of proven no-clean fluxes designed for today’s industry challenges, such as electronics devices in applications from the Internet of Things (IoT) to mobile devices and next-generation applications.
Explain your requirement *
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR