Saki to Exhibit Next-Gen Inspection Solution Upgrades at SMTconnect 2022

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Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be participating at SMTconnect 2022 in Nuremberg, Germany, from 10-12 May. Visitors are invited to Saki’s booth 135 in Hall 4A to see the latest inspection solution upgrades of the company’s 3D-SPI, 3D-AOI, and 3D-AXI inspection ranges. The Saki technology team will also present the latest hard- and software innovations including Saki’s innovative Z-axis optical head control for 3D-AOI systems alongside its bottom-side 2D-AOI and latest 3D-SPI platform.

With live demonstrations, Saki will offer booth visitors a first-hand look at the unique features of the latest hardware and software releases with an emphasis on reliability, speed, quality, and Smart Factory readiness for applications across all industrial sectors.

Show-highlights include:

3D-AOI

3Di-LS2 with 12μm high-resolution Z-axis optical head control feature, and side camera

Saki’s new Z-axis optical-head control feature was developed in response to the increase in customer applications demanding accurate inspection of tall components, press-fit components, and PCBAs in jigs. The innovative optical head offers the industry’s highest level of inspection capability with a height-measurement range in 3D mode up to 40mm. The focus height in 2D is also increased to 40mm. With these capabilities, Saki’s 3Di-AOI Series fulfills inspection capabilities and flexibility far beyond standard SMT inspection processes with accuracy, speed, and ease.

3D-CT AXI

3Xi-M110

Saki’s compact, lightweight, Inline 3D-CT automated X-ray inspection (AXI) machine for printed circuit board assemblies. The 3Xi-M110 machine, which now comes with new software that reduces cycle time by up to 50%, ensures the quality of hidden solder joints for bottom-electrode packages such as BGAs, LGAs, QFNs, flip-chip, and package-on-package and provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow, and other defects that are difficult to identify.

3D-SPI

3Si-LS2

Saki’s high-precision and high-speed 3D solder paste inspection machine. The single-lane system is equipped with a 12µm camera head for board sizes from 50 mm ×60 mm to 500 mm × 510 mm. 

2D-AOI

2Di-LU1 (bottom-side 2D-AOI)

The 2Di-LU1 is a 2D-AOI machine of choice for fast, stable, and reliable automated inspection of the bottom side of PCBs. It shares the same software platform as Saki’s 3D-SPI and 3D-AOI solutions. Its proprietary high-speed Line Scan imaging technology ensures the quality of through-hole solder parts after a dip, selective, and wave soldering, and improves productivity. Using the same system options as Saki’s SPI and AOI solutions reduces operator workload and running costs.

Full Line Control Software Solutions

Saki’s software suite & line control systems demonstrate the company’s data-driven approach to continuous product improvement. Visitors to the Saki booth will experience the full IPC-CFX certified machine-to-machine connectivity capability, full line control enabled by Saki’s Offline Teaching station (BF2-Editor), Verification station (BF2-Monitor), Multi-Process View, and QD Analyzer for advanced Statistical Process Control (SPC).

“Germany has long been regarded as the manufacturing powerhouse of Europe, and, together with our longstanding partner Selecs, we are excited to be back at SMTconnect after the live show had to be canceled two years in a row due to the global pandemic. We are looking forward to meeting our customers and prospects live and in-person to introduce them to our latest inspection solutions,” said Jarda Neuhauser, General Manager of Saki EU.