KIC to Showcase Reflow and Wave Soldering Optimization Solutions at SMTconnect 2022

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KIC, the thermal process experts who make ovens smarter, will showcase its Reflow Process Inspection (RPI) and Wave Process Inspection (WPI) at SMTconnect in Hall 4, Stand 452 on  May 10-12, 2022 in Nuremberg. Along with RPI and WPI, the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.

Electronics manufacturing today requires automated and real-time process control and traceability. Like SPI and AOI are for optical inspection, an inspection of the production reflow temperature profile is a must. Can you imagine a line without SPI or AOI? So why go without it for reflow, cure, or wave soldering. Process control, traceability, and quality solder joints can be delivered with real-time inspection capabilities. That is what KIC provides (and invented) for your thermal processes. This critical data should be a part of your overall Industry 4.0 smart factory solution to ensure all production through the oven is within specifications and that profile data is readily available for each individual board.

KIC has solutions for challenges such as handling process audits, automating manual profiling and data reporting tasks, MES connectivity, Industry 4.0 implementation, NPI process setup, reducing solder defects (voiding, head in pillow, tombstoning), and more.

The latest addition to the thermal process inspection family is KIC’s WPI, bringing its award-winning technology and thermal experience to the wave solder process. Wave Process Inspection provides users with automatic profiling – including an industry-first dwell time and parallelism measurement for each production board – real-time preheat and wave analytics, automatic SPC charting, and more.