Latest PCB (Printed Circuit Board) News | Page 47

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has received a Gold Level 2021 TTI Europe Supplier Excellence Award for the third consecutive year. Bestowed by TTI, the world’s leading aut... Read More

ICAPE Group, the custom solutions provider to the Printed Circuit Boards and Technical Parts, congratulates Erik Pedersen on his new position as FAE and Quality Director. Erik Pederson has 33 years of experience, which will help him to co-create new technologies with customers and manage complex PCB... Read More

Verified Market Research recently published a report, "Automated Optical Inspection System Market" By Type (2D AOI Systems, 3D AOI Systems), By Technology (Inline AOI, Offline AOI), By Application (Automotive, Consumer Electronics), and By Geography. According to Verified Market Research, ... Read More

Neways, an international innovator in electronics for smart mobility, connectivity and semicon solutions, joins a research consortium to develop a fully circular generation of electronics. The consortium will be led by the University of Leiden in collaboration with leading companies in the electroni... Read More

A unique consortium has been formed between industry-leading companies and academic institutes to introduce Graphene into advanced printed circuit boards.Graphene is a phenomenal 2D material made out of carbon hexagons. Despite its monoatomic thickness, it is extremely strong and has better electric... Read More

Indium Corporation® has expanded its portfolio of proven pastes with two new AuSn pastes, AuLTRA™ 3.2 and AuLTRA™ 5.1, designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive, infrastructure, ... Read More

The Isola Group will be well represented by circuit material professionals at the upcoming 2022 IEEE International Microwave Symposium (IMS2022) Exhibition in Denver, CO from 21-23 June. They will welcome visitors to exhibition booth #5090 with detailed data and free guidance on how to trim los... Read More

Indium Corporation, a leading supplier of solder materials for laser, optical, and RF microwave applications will be showcasing their Au-Based alloys at the upcoming IMS 2022 event in Denver, Colorado from 21-23 June. Au-based alloys are a great choice to ensure good performance and reliability for ... Read More

SEMICON SEA 2022 is the largest platform that promotes the growth of the semiconductor and microelectronics ecosystem in Southeast Asia by connecting companies, suppliers, and buyers from across the supply chain – from R&D and design to manufacturing and application development. The event ... Read More

IPC announced the April 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program in which the total North American PCB shipments in April 2022 were up 2.1 percent compared to the same month last year. However, compared to the preceding month, April shipments fell 20.4 pe... Read More

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, has announced that it has received an order from Cobham Advanced Electronic Solutions for a Pulsar solderability system. The Pulsar utilizes the highly proven dip-and-look ... Read More

Indium Corporation has introduced NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC) 2022, San Diego, Calif., the U.S. Engineered with high-tack characteristics, NC-809 is designed to hold die or solder spheres in place wi... Read More

Firan Technology Group Corporation announced that IPC's Validation Services Program has awarded requalification for IPC-1791, Trusted Electronics Fabricator Requirements Qualified Manufacturers Listing (QML) to FTG Circuits Fredericksburg, VA. FTG is a global corporation offering design, develop... Read More

IPC's Validation Services Program has awarded a requalification of the IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to AirBorn  for two U.S. locations: Georgetown, Texas, and Lake City, Pa. AirBorn continues to be a trusted source and supplier to original equipment man... Read More

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, has announced the release of its new AIM LUX Product Line. As a leading supplier to the miniLED industry, AIM designed its LUX solder materials to provide tier one manufacturers of LED, miniLED, and ... Read More

IPC has announced the formation of IPC Electronics Europe. The subsidiary was officially registered with the German government on May 4, 2022. The new entity’s main office is located in central Munich.   John W. Mitchell, IPC president, and CEO commented, “While we have be... Read More

Atotech is looking forward to presenting at the IEEE 72nd Electronic Components and Technology Conference (ECTC). This international event organized by IEEE Electronics Packaging Society will take place in San Diego, California from Tuesday, May 31, to Friday, June 3, 2022.The team has announced tha... Read More

Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has developed the new 3Di series of high-speed, high-precision, next-generation in-line 3D automated optical inspection (3D AOI) systems for complex inspection of high-density printed circuit boards and ... Read More

SIMMTECH, a South Korea-based global leading manufacturer of semiconductor packaging substrate and HDI Printed Circuit Board (PCB), held the grand opening ceremony for its Malaysia-based subsidiary, SUSTIO in Batu Kawan Industrial Park, Penang. This new factory will be SIMMTECH’s first advance... Read More

The 72nd IEEE Electronic Components and Technology Conference (ECTC) 2022 will be held from May 31 to June 3, 2022 at The Sheraton San Diego Hotel and Marina, San Diego, CA, U.S.A. ECTC is the premier international event that brings together the best in packaging, components and microelectronic syst... Read More