Indium Corporation® Launches AuSn Solder Pastes for High-Power LEDs with Higher Processing Temperatures

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Indium Corporation® has expanded its portfolio of proven pastes with two new AuSn pastes, AuLTRA™ 3.2 and AuLTRA™ 5.1, designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive, infrastructure, and horticulture.

Indium Corporation produces a wide range of solder paste products to meet the current and evolving needs of the industry. High-power LEDs have the ability to provide much higher levels of light output than traditional LEDs while also providing higher levels of performance, leading to a longer lifetime of the device. Due to the large amount of heat generated—in such a localized area—a high-melting and high-reliability solder is required for assembly.

It is also critical to the LED assembly process that the solder interface between the diode and its substrate is void-free in order to generate a stable transmission of light and allow for the transfer of the tremendous heat generated by the diodes to maintain the temperature stability of the device.

AuLTRA™ 3.2 and AuLTRA™ 5.1 are AuSn solder pastes specifically formulated to accommodate higher processing temperatures while providing high reliability.

AuLTRA™ 3.2 offers:

• Water-soluble flux
• Air or nitrogen reflow
• Superb wetting
• Low-voiding
• Long open life, reduced waste

AuLTRA™ 5.1 offers:

• No-clean residue
• Air or nitrogen reflow
• Superb wetting
• Low-voiding
• Long open life, reduced waste

Both pastes are offered in a variety of AuSn alloys and powder sizes. In addition to being ideal for use in high-power LED module array applications, AuLTRA™ 3.2 and AuLTRA™ 5.1 are applicable for all AuSn paste applications as their performance has been, and continues to be, proven in the field.

Click here to learn more about Gold-tin (AuSn) solder pastes from Indium Corporation.