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Atotech is looking forward to presenting at the IEEE 72nd Electronic Components and Technology Conference (ECTC). This international event organized by IEEE Electronics Packaging Society will take place in San Diego, California from Tuesday, May 31, to Friday, June 3, 2022.
The team has announced that Mr. Kuldip Johal, Global OEM Pathfinding Director will be part of the 2022 ECTC Special Session on “How will IC substrate technology evolve to enable next-generation heterogeneous integration schemes for high-performance applications?” on Tuesday, May 31 from 3:30 p.m. to 5:00 p.m. (PDT).
Additionally, Atotech's experts Dr. Britta Schafsteller, Global Product Manager Selective Finishing, and Dr. Tobias Bernhard, Senior Scientist Electronics R&D Desmear and Metallization, will present and share their expertise.
Date: Wednesday, June 1
Time: 2:20 – 2:45 p.m. (PDT)
Impact of the final finish on the solder joint reliability and IMC formation after thermal storage”
by Dr. Britta Schafsteller.'
Date: Friday, June 3
Time: 3:30 – 3:55 p.m. (PDT)
“Plating and recrystallization of galvanic Cu films on roll annealed and polycrystalline Cu foils and the effect of intermediate electroless Cu layers”
by Dr. Tobias Bernhard.
Click here to learn more about the ECTC 2022.
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