YINCAE Develops Die Attach Material that can Withstand Temperature of -273°C Without Delamination

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YINCAE, a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials, has announced that it has developed DA 158N die-attach materials which are thermally conductive and electrical insulating adhesives. It can be fast cured at low temperatures and can be used in preparing the materials for people to live on Mars.

Due to its unique properties, DA 158N die-attach adhesive has high thermal conductivity and can achieve a very thin bonding line thickness, there are no bleeding or migration issues. Furthermore, the DA 158N has excellent bonding strength and thermal cycling performance that is significantly greater than that of the leading competitors’. The DA 158N can withstand extreme temperatures ( -273°C) without any delamination, and still outperform current competitor products on the market. This not only has extraordinary implications for the use of DA 158N but also indicates the broad range of uses it potentially has across current industries.

This material can be used for all die attach applications, particularly for harsh condition applications. While it is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits, and multi-chip modules. It is designed for high production and a friendly environment where process speed and reliability are the key concerns. This material is easily dispensed, minimizes induced stresses, provides outstanding reliability performance (e.g. temperature cycling performance), and excellent mechanical resistance.