ResearchAndMarkets has added a new report "Electronic Contract Manufacturing and Design Services - Global Strategic Business Report" to its offering.The global market for Electronic Contract Manufacturing and Design Services is estimated at US$548.2 Billion in 2023 and is projected to reac... Read More
HTF Market Intelligence has published a new study that researches the 5G PCB Market and evaluates market size, trends and forecast up to the year 2030. The 5G PCB market study includes significant research data and evidence to be a practical resource document for managers and analysts, ind... Read More
United Microelectronics Corporation (UMC), a global semiconductor foundry and Cadence Design Systems announced that the Cadence® 3D-IC reference flow, which uses the Integrity 3D-IC Platform, has been certified for use with UMC's chip stacking technologies, enabling a quicker time to market.... Read More
SABIC, a global leader in the chemical industry, today introduced ULTEM™ 3473 resin, its first polyetherimide (PEI)-based material with surface mount technology (SMT) capability. This new product addresses the growing trend toward smaller, lighter 5G macro cells by providing a possible replace... Read More
Sumitomo Electric Industries, Ltd. has announced the successful mass production of its new fluororesin-based flexible printed circuits (FPCs), FLUOROCUIT, that demonstrate a high flexibility and low transmission loss in the mmWave band, aiming at communications for 5G and beyond.In wireless communic... Read More
Toyochem Co. Ltd., a member of the Toyo Ink Group, has introduced a highly flexible electromagnetic interference (EMI) shielding film, the LIOELM TSS510-HF, designed to meet the demanding performance requirements of 5G flexible printed circuits (FPCs). It addresses the needs of today’s electro... Read More
Toray Industries has announced that it has created a polyphenylene sulfide (PPS) film that maintains the outstanding dielectric characteristics or low dielectric losses of electrical energy, flame retardant, and chemical robustness of that polymer while remaining thermally resistant at 40°C high... Read More
DesignCon, the world's premier conference for chip, board, and systems design engineers, has announced new areas of focus for the 2020 edition highlighting advances in the fields of 5G, artificial intelligence (AI), automotive, and IoT, producing the most in-demand electronics emerging today.Top... Read More
Electromagnetic interference (EMI) is a big challenge for current generation mobile phones and 5G technology and devices. It can disrupt electronic devices, equipment and systems – in consumer electronics like mobile phones but also in automotive, medical or aerospace electronics. With highe... Read More
Rogers Corporation has introduced new UL 94 V-0 antenna-grade laminates manufactured with standard profile electrode posited copper foil to meet present and future performance requirements in active antenna arrays and small cells, specifically for IoT and 5G systems. With the option of multip... Read More
Rogers, at the on-going IMS 2019 in Boston, is showcasing its extensive portfolio of PCB and laminate materials for the 5G and autonomous vehicle industry. The products they plan to feature include the RO4835T laminates, RO4450T bonding materials, CU4000 and CU4000 LoPro foils, as w... Read More
Explain your requirement *
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR
