Rogers Exhibiting Latest PCB & Laminate Materials for 5G at IMS 2019

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Rogers, at the on-going IMS 2019 in Boston, is showcasing its extensive portfolio of PCB and laminate materials for the 5G and autonomous vehicle industry. The products they plan to feature include the RO4835T laminates, RO4450T bonding materials, CU4000 and CU4000 LoPro foils, as well as the RO3003G2, a next generation high-frequency laminate for automotive radar sensor applications.

Highlights of the products to be showcased at Rogers Booth:

RO4835T Laminates:

• offered in 2.5 mil, 3 mil and 4 mil core thicknesses,
• 3.3 dielectric constant (Dk)
• low loss
• spread-glass reinforced
• ceramic-filled thermoset materials designed for inner-layer use in multilayer board designs
• complement RO4835 laminates when thinner cores are needed.

RO4450T Laminates:

• 3.2-3.3 Dk
• low loss
• spread-glass reinforced and ceramic-filled
• designed to complement the RO4835T and the existing RO4000 laminate family
• available in 3 mil, 4 mil and 5 mil thicknesses

CU4000/CU4000 LoPro Foils: They are sheeted foil options for designers looking for foil lamination builds and provide good outer-layer adhesion when used with RO4000 products.

RO3003G2 High Frequency Laminates:

• build on the RO3003 platform to provide radar sensor designers with improved insertion loss and reduced Dk variation. Combination of Rogers’ optimized resin and filler content along with the introduction of very low-profile ED copper translates to Dk of 3.00 @ 10 GHz (clamped stripline method) and 3.07 @ 77 GHz (microstrip differential phase length method)
• show very low insertion loss of 1.3dB/inch for 5 mil laminates as measured by the microstrip differential phase length method
• are an extension of RO3003 laminates that incorporate Rogers’ decades-long experience working with automotive radar customers and understanding the increasing product performance requirements

Roger’s RO4835T laminates and RO4450T bonding materials exhibit excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through-hole reliability and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully-cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminate and RO4450T bond-ply have the UL 94 V-0 flame retardant rating and are compatible with lead-free processes.

In addition to the product showcase, Technical Marketing Manager, John Coonrod, will be hosting a technical session on “Critical Material Properties for 5G PCB Applications” from 2:30 – 2:45 p.m. on Tuesday, June 4 and The Impact of Glass Weave Effects on mm-Wave PCBs from 2 – 2:15 p.m. on Thursday, June 6 in the MicroApps Theater.