Latest PCB (Printed Circuit Board) News | Chip

Kaynes Technology, an end-to-end and IoT solutions-enabled integrated electronics manufacturer, has bought land in Sanand, Gujarat, to build a new outsourced semiconductor assembly and test (OSAT) unit. Based on the growing demand from potential customers, the company hopes to put about Rs 5,000 Cr ... Read More

Cadence Design Systems, announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes. The ongoing collaboration between Cadence and Samsu... Read More

As automotive applications, 5G and 6G, smart devices and many other devices require ever more compact and powerful components, advanced packaging becomes one of the key technologies. With its new SIPLACE CA hybrid placement solution, market and technology leader ASMPT combines semiconductor and SMT ... Read More

Raytheon, an RTX business, has been awarded a $20 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation multi-chip package for use in ground, maritime and airborne sensors.Under the contract, Raytheon wi... Read More

AT&S will officially open its first plant in Kulim, Malaysia, on 24 January 2024 and expects numerous guests from the world of politics and business on this occasion. The new AT&S plant in Kulim will produce IC substrates for the next generation of microchips for high-performance comput... Read More

Technavio has released a research report titled "Chip Mounter Market by Technology, Application, and Geography - Forecast and Analysis 2023-2027", with the chip mounter market expected to grow by USD 1.34 billion between 2022 and 2027. The growth momentum of the market will progress at a C... Read More

SkyWater Technology, the trusted technology realization partner, announced it has submitted a full application to the CHIPS Program Office of the U.S. Department of Commerce for funding through the CHIPS and Science Act. The application is for modernization and equipment upgrades to enhance producti... Read More

Tachyum has revealed that employing new electronic design automation (EDA) software in the Prodigy® Universal Processor's physical design stage has led to markedly improved outcomes in chip specifications compared to earlier projections. This success followed the effective transition to upda... Read More

Lockheed Martin and GlobalFoundries (GF) have announced a strategic collaboration to advance U.S. semiconductor manufacturing and innovation and to increase the security, reliability and resiliency of domestic supply chains for national security systems. This collaboration will enable... Read More

The EIPC Summer Conference in Munich, scheduled for June 15-16, is set to feature a presentation by Stan Heltzel, Materials Engineer at the European Space Agency, who is responsible for qualifying Printed Circuit Board (PCB) manufacturers and technology development. Heltzel, also the convenor of wor... Read More

Keysight Technologies, an S&P 500 company, delivers market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product lifecycle.  Recently Keysight released a new Universal Signal Processing Architecture (USPA) pr... Read More

United Microelectronics Corporation (UMC), a global semiconductor foundry and Cadence Design Systems announced that the Cadence® 3D-IC reference flow, which uses the Integrity 3D-IC Platform, has been certified for use with UMC's chip stacking technologies, enabling a quicker time to market.... Read More

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission are gathering in Washington, D.C. this week to discuss "the next big thing" in CHIPS Act implementation: expanding "advanced packaging"... Read More

Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see a European Chips Act that would bolster the entire semiconductor ecosystem, including those segments critical to advanced packaging. That’s good news... Read More

Henkel announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The material, Loctite Eccobond UF 9000AG, enables advanced silicon (Si) node flip chip integration by providing robust interconnect protection and compa... Read More

Indium Corporation has introduced NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC) 2022, San Diego, Calif., the U.S. Engineered with high-tack characteristics, NC-809 is designed to hold die or solder spheres in place wi... Read More

Advanced Thermal Solutions is now providing quadFLOW™ active CPU coolers, designed to cool high powered chips in densely filled locations. quadFLOW active coolers pull air from four directions to maximize thermal performance where airflow is limited, and conventional cooling solutions are inef... Read More

Advanced Semiconductor Engineering, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company have announced the formation of an industry consortium, the Universal Chiplet Interconnect Express (UCIe). It aim... Read More

Advanced Thermal Solutions is now providing quadFLOW™ active CPU coolers, designed to cool high-powered chips in densely filled locations. quadFLOW active coolers pull air from four directions to maximize thermal performance where airflow is limited, and conventional cooling solutions are inef... Read More

The electronics manufacturing industry is welcoming the release of the European Commission’s European Chips Act with its strong support for advanced packaging and calling for its swift implementation as part of a broader and equally important strategy to rebuild the European electronics manufa... Read More