TTM announced that it has signed a definitive agreement to sell its Shanghai Backplane Assembly (“BPA”) for approximately $11.8 million, subject to customary post-closing adjustments, to DBG Holdings Limited (“DBG”), which is wholly owned by DBG Technology. This transaction i... Read More
AIM announced the release of its newest no clean, halogen-free solder paste, H10. H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste.H10 solder paste is capable of transfer efficiency >... Read More
Hexagon's manufacturing intelligence division and Altium have entered a strategic partnership with an aim for increased environmental sustainability in design and manufacturing of electronics. The partnership combines Hexagon's expertise in utilizing data from design and engineering, manufac... Read More
ICAPE, a technology distributor of printed circuit boards (PCB), declared the expansion of its logistics solutions to keep up with the rising demand for PCB and technical parts from the electronics industry. As part of ICAPE Group's strategy to establish a local presence in multiple countries, t... Read More
Yamaha announced the establishment of a new company in Singapore, in response to the rising demand for robots in Southeast Asia and India. By conducting manufacturer-driven cross-selling in the surface mounter and industrial robot fields, Yamaha Motor intends to secure new clients in Southeast Asia ... Read More
United Microelectronics Corporation (UMC), a global semiconductor foundry and Cadence Design Systems announced that the Cadence® 3D-IC reference flow, which uses the Integrity 3D-IC Platform, has been certified for use with UMC's chip stacking technologies, enabling a quicker time to market.... Read More
The Open Compute Project Foundation (OCP) and JEDEC announce a new partnership to create a new framework for transferring technology defined in an OCP-approved specification to JEDEC for incorporation in one of its standards. Through this collaboration, individuals from the OCP and JEDEC communities... Read More
AIM, a global manufacturer of solder assembly materials for the electronics industry, announced their impending attendance at the IPC APEX EXPO, which will be held at the San Diego Convention Center in San Diego, California, from January 24-26, 2023. AIM will announce and launch their new zero ... Read More
Taiyo has announced a new partnership with Viking Test. Through this partnership, Taiyo intends to execute its ongoing strategy to increase technical and sales support for Taiyo’s range of coaters and ovens operating in the Indian and UK regions, with Viking Test as their distributors.The scop... Read More
Taiyo Circuit Automation announced a new partnership with Shur-Loc Fabric System. This partnership will combine Taiyo Circuit Automation's world-renowned solder mask equipment with Shur-Loc’s unique screen-making system.The benefits of this unique system:• Enables express replacement ... Read More
DarwinAI, an innovative Industry 4.0 company that is transforming manufacturing by instilling trust in Artificial Intelligence (AI), announced a $6M USD investment round led by BDC Capital’s Deep Tech Venture Fund with participation from new and existing investors. The investment extends the c... Read More
IDTechEx released a report titled “Sustainable Electronics Manufacturing 2023-2033" which explores the key opportunities for sustainable innovation and the most promising new manufacturing approaches. The report concentrates on the fundamental building blocks of electronics – printe... Read More
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announced the opening of its new solution center – the “Saki Solution Center Thailand” – in Nonthaburi, Thailand. As well as comprising the recently relocated main offices for Sak... Read More
ViTrox is bringing back engaging workshops and a physical career fair to Penang International Science Fair (PISF) participants this coming December. It aims to cultivate and inspire science, technology, engineering, and mathematics (STEM) enrolment among young generations.PISF is the biggest annual ... Read More
Avishtech, the leading provider of PCB simulation solutions, today announced the launch of its Gauss Sustainability offering. With this offering, users can assess design-specific CO2-equivalent emissions for their printed circuit board designs. This assessment includes the full set of raw materials ... Read More
YINCAE Advanced Materials announced that their company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category. This ceremony took place on Wednesday, November 2nd at SMTAI 2022 Exhibition in Minneapolis, USA.YINCAE’s die attach material was recogni... Read More
Singapore-based Excelpoint Systems (“Excelpoint”), a leading regional B-to-B business platform providing quality electronics components with integrated R&D capabilities, and Bkav Hardware Solution (“BHS”), a member of Vietnam-based Bkav Corporation (“Bkav”) th... Read More
Isola Asia will be well represented by its circuit material experts at the 2022 Taiwan PCB & Assembly (TPCA) Show, as they advise attendees on the optimum uses of their materials for the growing numbers of high-frequency analog and high-speed-digital (HSD) electronic circuit applications. Isola&... Read More
Semtech Corporation, a leading global supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, announced the release of the HotSwitch® platform. This platform includes integrated load switches and eFuses with first-of-their-kind elevated protection feature set... Read More
Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference in Taipei, Taiwan on October 27. The presentation will cover... Read More
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