AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, has announced the release of its new low-voiding, no-clean solder paste, V9.Formulated to solve one of the industry’s most difficult challenges, studies have proven V9 to reduce voiding to as l... Read More
The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will present low voiding solutions at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.Customer Technical Engineer, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as... Read More
DuPont Microcircuit and Component Materials (MCM) is collaborating with the Industrial Technology Research Institute (ITRI) of Taiwan to demonstrate the value of DuPont™ GreenTape™ LTCC (Low-Temperature Co-fired Ceramics) material used in AiP (Antenna in Package) applications. This colla... Read More
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, has introduced a system solution for dispensing single-component (1K) thermal interface materials by integrating the ASYMTEK Helios® SD-960 Series fluid dispensing platform with the new FS-EP1 Fluid Supply/... Read More
As Per IPC’s May Global Sentiment of the Electronics Supply Chain Report, nine in ten electronics manufacturers surveyed are currently experiencing rising material costs, while nearly four-fifths are experiencing rising labor costs. Supporting data from IPC’s May Economic Report, indicat... Read More
Atotech, a leading specialty chemicals technology company and a market leader in advanced electroplating solutions, and Schweitzer Engineering Laboratories (“SEL”), an industry leader in the design and manufacture of digital products and systems that protect, control, and automate electr... Read More
Isola Group brings the latest cost-effective, high-performance PCB material solutions for hybrid circuits to this year’s Del Mar Electronics & Manufacturing Show (DMEMS2022). With growing demand for miniaturization in electronic design, Isola’s materials support compact PCBs for... Read More
Hentec Industries/RPS Automation has announced that it will exhibit its full line of selective soldering, component lead tinning, and solderability test equipment at the upcoming SMTA Huntsville Expo & Tech Forum to be held at the Jackson Center, in Huntsville, Alabama on April 12, 2022.At the S... Read More
MacDermid Alpha will feature the recently launched ALPHA OM-565 HRL3 low-temperature solder paste at the SMTA Huntsville Expo & Tech Forum to be held at the Jackson Center on April 12, 2022. ALPHA OM-565 HRL3 is formulated for a broad range of assemblies to mitigate warpage-induced defects in te... Read More
YINCAE, a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials, has announced that it has developed DA 158N die-attach materials which are thermally conductive and electrical insulating adhesives. It can be fast cured at low temperatures and can be used... Read More
NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, announced that it has generated $17 million in funding (including $8.7M in cost-share contribution from participants) for 18 new projects as part of its Project Call 6.0 to further promote FHE development and a... Read More
Lawrence Berkeley National Laboratory (Berkeley Lab) has developed a compact, robust, and low-cost method for interconnecting printed circuit boards (PCBs) without requiring soldering or additional components. These narrow board-in-board connectors can handle higher voltages and mechanical stresses ... Read More
EMC will be highlighting extreme low loss materials EM-892K / EM-892K2 (“K” indicates low Dk/Df glass, while “K2” stands for next-generation low Dk/Df glass) at DesignCon 2022, which will be held from April 5 to April 7 at Santa Clara, CA. These materials have been the b... Read More
MacDermid Alpha Electronics Solutions has announced the launch of ALPHA OM-565 HRL3, a next-generation, high-reliability low-temperature solder paste formulated for a broad range of assemblies to mitigate warpage-induced defects in temperature-sensitive chip-scale packages.ALPHA OM-565 HRL3 solder p... Read More
Construction has started on the new AT&S research center in Leoben. By 2025, the company will invest a total of € 500 million at the headquarters of the Austrian high-tech company to construct a new building with more than 10,000 square meters for research and production. The Chairman of th... Read More
The Power Electronics Division of MacDermid Alpha Electronics Solutions will be presenting the technical paper “Automotive Traction Module Attach by Silver Sintering – Process, Performance, and Reliability” at the APEC 2022 Power Conference taking place from March 20-24, 2022 in Ho... Read More
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Rocky Mountain Expo & Tech Forum, scheduled to take place Thursday, March 10, 2022, at Coors Field in Denver, CO. The company will discuss its new AQUANOX® A4626 Next Generation Aqu... Read More
Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr Dongkai Shangguan, strategic advisor, at the Surface Mount Technology Association’s Wafer-Level Packaging Symposium, Feb. 15-17, San Jose, Calif., U.S. Indium Corporat... Read More
Rogers Corporation, a global leader in engineered materials, launched its Radix 3D Printable Dielectrics family of products at the IPC APEX EXPO 2022 at the San Diego Convention Center in San Diego, CA. The IPC APEX EXPO is the leading event for the printed circuit board and electronics manufacturin... Read More
Isola Group, a leading global manufacturer of copper-clad laminates and dielectric prepregs for printed circuit boards (PCBs), will be on hand at the IPC APEX EXPO 2022 exhibition with examples of its high-performance circuit materials for high-speed digital circuits, including Tachyon® 100G and... Read More
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