EMC to Launch 112Gb/s Design and New IC Substrate Materials at DesignCon 2022

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EMC will be highlighting extreme low loss materials EM-892K / EM-892K2 (“K” indicates low Dk/Df glass, while “K2” stands for next-generation low Dk/Df glass) at DesignCon 2022, which will be held from April 5 to April 7 at Santa Clara, CA. These materials have been the best-in-class performers since 2020. Along with this EMC will also showcase advanced technologies like PCIe 5.0/ 6.0, 5G/ 6G, 112 Gb/s, or even 224 Gb/s Serdes Speed for 800G and future 1.6TB Ethernet applications. 

Both low loss materials have been formulated with EMC’s cutting-edge Halogen-Free technologies to enable EM-892K to reach Dk 2.9 / Df 0.0017 and EM-892K2 to achieve Dk 2.8 / Df 0.0013@10GHz. Both versions of EM-892K can withstand a minimum of 7 lamination cycles. Numerous Tier-1 OEMs, ODMs and PCB fabricators have already qualified the EM-892K and EM-892K2 materials with HVLP3 or HVLP4 foil to tackle future 800G design challenges.

Penetrating both ELIC designs and substrate-like CTE applications, EMC has introduced the 2nd generation IC Substrate materials “EM-S530/ S530K” designed for antenna-in-package (AIP) and “EM-S570” ideal for FCBGA/ FCCSP applications.

In addition to these materials, EMC’s newly acquired local US operation, Arlon EMD, is introducing a new polyimide product 86HP. The 86HP uses a unique polyimide resin that has exceptional Anti-CAF performance. Arlon’s 86HP is ideal for use in designs with tightly packed thru-hole configurations, HDI, high layer counts, and high-temperature applications. 

Applications in 5G, IOTs, edge computing, AI, data center, and emerging cloud technologies have called for increased transmission speed and bandwidth. These requirements drove EMC to develop advanced technologies like PCIe 5.0/ 6.0, 5G/ 6G, 112 Gb/s or even 224 Gb/s Serdes Speed for 800G and future 1.6TB Ethernet applications.

EMC and Arlon, jointly welcome global OEMs, ODMs and PCB Fabricators to stop by their Booth #418 at DesignCon 2022 to learn more about our latest product offerings.