Indium Corporation Experts Share Insights on Advanced Soldering Solutions at SMTA International 2024

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Indium Corporation experts shared their technical insight and knowledge on a variety of industry-related topics throughout SMTA International (SMTAI), October 21-24, in Rosemont, Illinois at Booth 2300.

Monday, October 21

• Supercooled Solder Pastes in Low-Temperature Attach Applications by Dr. Yifan Wu, co-authored by Dr. Ian Tevis and Radhika Jadhav
  • This presentation discussed the use of metastable solder pastes as a solution for low-temperature soldering, enabling full metal interconnects at significantly lower temperatures. The study highlights the application of supercooled bismuth-tin (BiSn) pastes in next-generation electronics, where traditional high-temperature processing could cause material degradation.

Wednesday, October 23

• Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components by Sr. Product Specialist – Semiconductor and Advanced Assembly Materials, Evan Griffith, co-authored by Ravi Parthasarathy, ZESTRON Corporation, and Patrick Lawrence, ITW EAE
  • This presentation addressed the growing challenges in cleaning advanced packaging technologies, such as SiP, fcBGA, PoP, and 2.5D, as these designs incorporate larger die sizes, more bump counts, and lower standoff heights. The results will provide insights into optimization advantages, helping manufacturers reduce the risk of failures, improve efficiency, and ensure optimal cleaning consistency and repeatability.

Thursday, October 24

• Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach by Evan Griffith, co-authored by David Heller, Xike Zhao, Phil Lehrer, Heller Industries
  • This presentation will explore the challenges of miniaturization in electronics, particularly the difficulty of choosing an appropriate material for soldering in flux-free environments. This paper will introduce a novel tacky agent for use in formic acid reflow, and offer a material and equipment solution for customers looking to jointly use paste and flux in a formic acid reflow system for advanced packaging builds.
• Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball Grid Arrays Assembled with LTS by Francis Mutuku, co-authored by R&D Manager, Alloy Group, and Principal Metallurgist Dr. HongWen Zhang, Huaguang Wang, and Tyler Richmond
  • The presentation explores the impact of dynamic warpage on solder joint reliability in large ball grid array (BGA) packages during reflow, testing, or service. There will be an emphasis on mitigating risk factors to ensure high-quality solder joints in large PBGA assemblies.
• Soldering Challenges Caused by Warpage and Deformation of Large-Size Server Integrated Circuits by Dr. Ronald Lasky, co-authored by Senior Sales and Business Development Manager Chris Nash and Regional Product Manager Wisdom Qu
  • This presentation will focus on the challenges brought on by the warpage of large-size IC packages, particularly in ball grid array (BGA) formats, used in server CPUs/GPUs. The session will propose solutions to mitigate these issues in electronic assembly.

In addition, two Indium Corporation experts also served as chairs for two extended sessions:

• On Tuesday, October 22, 8:30 am - 10:00 am, Dr. Lasky chaired the Solder Joint Reliability session.
• On Wednesday, October 23, 11:30 am - 12:30 pm, Dr. Mutuku chaired the Thermal Fatigue Reliability session

Click here to learn more about SMTA International 2024 event coverage on PCB directory.