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AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, has announced its participation in the upcoming SMTA Space Coast Expo & Tech Forum, which will take place on November 14 at the Melbourne Auditorium in Melbourne, Florida. AIM will highlight its recently released NC259FPA Ultrafine No Clean Solder Paste among other great products.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die-attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and discover all of AIM’s products and services, visit the company at the SMTA Space Coast Expo & Tech Forum on November 14.
Click here to learn more about SMTA Space Coast Expo & Tech Forum.
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