Latest PCB (Printed Circuit Board) News | Page 68

  • Saelig Launches Smart Tweezers for On-board L/C/R Measurements & PCB Testing

    Saelig has introduced the ST-5S Smart Tweezers for on-board inductance, capacitance and resistance measurements, and PCB testing. This intelligent measurement tool is a new type of handheld LCR meter that can quickly test, identify, and measure board-mounted, surface-mounted and leaded devices witho... Read More

  • Call for Abstracts for PCB West 2020!

    The UP Media Group has announced that abstracts are now being accepted for PCB West 2020, to be held from 8th to 11th September 2020 in Santa Clara, CA. The event includes a four-day technical conference and a one-day exhibition at the Santa Clara Convention center.          ... Read More

  • Schweizer Signs Sales Distribution Agreement with Nagase to Target Japanese Market

    Schweizer Electronic AG has signed a distribution agreement with leading Japanese distributor company, Nagase. Under the agreement Nagase is entitled to distribute Schweizer's printed circuit boards and embedding solutions in the Japanese electronics market.The CEO of Schweizer Electronic, Dr. R... Read More

  • Atotech Exhibits its Latest Innovative Solutions at IPC APEX EXPO 2020

    Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, is exhibiting in the largest event for electronics manufacturing in North America - IPC APEX EXPO 2020, at the San Diego Convention Center from February 4 - 6. Atotech experts are presenting a... Read More

  • Saki Exhibits New Inspection Systems and Software at IPC APEX 2020

    Saki Corporation, a provider of automated optical and X-ray inspection and measurement equipment for PCBs, is showcasing its new automated inspection products, software, and capabilities at IPC APEX EXPO 2020 in San Diego, CA, from Feb. 4 to 6 (Booth #2025). The company has also announced its new pe... Read More

  • Highly Flexible EMI Shielding Film for 5G FPCs

    Toyochem Co. Ltd., a member of the Toyo Ink Group, has introduced a highly flexible electromagnetic interference (EMI) shielding film, the LIOELM TSS510-HF, designed to meet the demanding performance requirements of 5G flexible printed circuits (FPCs). It addresses the needs of today’s electro... Read More

  • Averatek Declares Calumet Electronics as its First A-SAP Licensee

    Advanced manufacturing solutions provider, Averatek has announced an A-SAP license agreement with Calumet Electronics. Averatek's A-SAP is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to ad... Read More

  • IPC APEX EXPO 2020 Best Technical Papers Announced!

    The IPC APEX EXPO Technical Program Committee has selected the Best Technical Conference Papers in the domestic and international categories for the IPC APEX EXPO 2020. The authors will receive their awards during the opening keynote session on Tuesday, February 4, 2020 during the event.Taking top h... Read More

  • Ventec to Showcase its Enhanced Materials Portfolio at IPC APEX 2020

    Ventec International Group will feature its brand new and enhanced set of high-performance, high-reliability high-speed/low-loss/high-frequency materials at the IPC APEX 2020 in San Diego (CA) on Booth #4434.With the rapid rise of 5G and sophisticated radar applications in automotive and other secto... Read More

  • Averatek to Showcase its Advanced PCB Manufacturing Technology at APEX 2020

    Averatek Incorporated has confirmed their participation at the upcoming IPC APEX EXPO 2020. The event is scheduled to take place from February 4-6, 2020 at the San Diego Convention Center in California. Averatek will be presenting advanced PCB manufacturing technology as well as sharing expertise an... Read More

  • Rogers to Showcase High-speed Laminates & Next-Gen Materials at DesignCon 2020

    At DesignCon 2020, Rogers Corporation, a leading provider of engineering materials and PCB solutions, will showcase some of its high-performance circuit materials used in multi-layer structures which include a family of thin laminates, bonding materials, and sheeted copper foil options.At the event,... Read More

  • Learn About the Evolving Electronics Design Landscape at DesignCon 2020

    DesignCon, one of the largest event for chip, board, and systems design engineers,  has announced its 2020 conference schedule presenting 14 newly refined and reorganized tracks covering a broad range of highly technical sessions, boot camps, tutorials, and more to fit the needs of the hardware... Read More

  • Robotas Technologies to Showcase its THT PCB Assembly Solution at APEX 2020

    Robotas Technologies Ltd, a pioneer of hand assembly automation systems, will exhibit (Booth 1316) its latest solutions at the 2020 IPC APEX EXPO, scheduled to take place from 4 to 6 February at the San Diego Convention Center in California. Among the main highlights of the company’s showcase,... Read More

  • PCB Connect Opens New Headquarter in Massachusetts, U.S

    PCB Connect has announced the opening of its the new North American headquarters in Sharon, Massachusetts. This will be the 16th global location for the Swedish printed circuit board supplier. When making the announcement, CEO Jonas Pettersson also announced the appointment of long-time PCB professi... Read More

  • IPC Announces E-Textiles Standard IPC-8921

    IPC, the Association Connecting Electronics Industries,  has announced the release of the latest IPC-8921 e-textiles Standards - Requirements for Woven and Knitted Electronics Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires. This is an international standa... Read More

  • Super PCB to Exhibit at IPC APEX EXPO 2020

    Super PCB, a single source leader for high quality printed circuit boards (PCBs) has confirmed its participation at the upcoming IPC APEX EXPO 2020. The event is scheduled to take place from February 4-6, 2020 at the San Diego Convention Center in California.At its booth (#4038), the company experts... Read More

  • GS Swiss PCB Installs Dynachem’s Advanced Automatic Vacuum Press Lamination line

    Switzerland-based leading PCB solutions provider, GS Swiss PCB, has announced the purchase of a an automatic vacuum press lamination line system from Dynachem, a brand of Automatic Lamination Technologies (ALT). GS has installed Dynachem’s latest offering, the AVPL Series 2 system. The Dual va... Read More

  • EPC Unveils Time-of-Flight Laser Diode Driver Demonstration Board with eGaN Technology

    EPC (Efficient Power Conversion), the leading developer of GaN-based power management devices, has released a 15 V, 28 A high current pulsed laser diode driver demonstration board, the EPC9144.In time-of-flight (ToF) systems, speed and accuracy of object detection is critical. As demonstrated on thi... Read More

  • Zuken Releases New Advanced Features for eCADSTAR Connected PCB Design Platform

    Leading software solution developer, Zuken, has unveiled advanced high-speed design features for its recently launched eCADSTAR connected PCB design platform. eCADSTAR Advanced HS extends eCADSTAR’s connected 3D PCB design capabilities with powerful high-speed routing tools, such as length &am... Read More

  • NextFlex Invests Over USD 12.5M in Flexible Hybrid Electronics Innovations

    NextFlex, America’s Flexible Hybrid Electronics (FHE) manufacturing institute has announced $12 million (including $7M in cost-share contribution from participants) in funding for seven projects as part of its Project Call 4.0 to further promote FHE adoption and development in the US advanced ... Read More

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