Averatek to Showcase its Advanced PCB Manufacturing Technology at APEX 2020

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Averatek Incorporated has confirmed their participation at the upcoming IPC APEX EXPO 2020. The event is scheduled to take place from February 4-6, 2020 at the San Diego Convention Center in California. Averatek will be presenting advanced PCB manufacturing technology as well as sharing expertise and experience in its deployment.

Averatek will first present on Tuesday, February, at the technical conference followed by participation in a panel discussion at the Sessions at the Intersection. This discussion will be open to all attendees. On Wednesday, February 5, Averatek will present at the inaugural community of interest meeting focused on additive PCB processes capable of feature sizes of 25 microns and below, exploring both the needs of next-generation electronics and the needs of PCB fabricators licensing this technology.     

Haris Basit, CEO of Averatek, said that the electronics industry is at an inflection point. Increasingly complex electronics continue to challenge traditional fabrication processes. Averatek’s A-SAP process resets the technology curve and opens up design opportunities that were previously unavailable.

Mike Vinson, President, and COO of Averatek stated that there is a lot to learn when working with new, emerging technology. This IPC conference provides the opportunity to meet with, listen to and educate OEM’s, PCB Fabricators, and EMS companies all in one location. Averatek have just scratched the surface on the ways A-SAP can be utilized in the design and they are looking forward to insightful discussion and feedback

Averatek’s A-SAP is an advanced manufacturing process for printed circuit board fabrication with trace and space as narrow as 15 microns. This process can dramatically reduce the space and weight of electronics systems, provide significant RF benefits and can be easily integrated with today’s traditional PCB manufacturing processes and materials.