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Advanced manufacturing solutions provider, Averatek has announced an A-SAP license agreement with Calumet Electronics. Averatek's A-SAP is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next-generation electronics.
COO of Calumet Electronics, Todd Brassard stated that Averatek’s A-SAP process is industry-transforming technology that will allow the U.S. to recapture the leadership position in electronics manufacturing, providing for dramatic reductions in size, weight, and manufacturing complexity, while significantly improving signal integrity and reliability.
According to the CEO of Averatek Haris Basit, Calumet Electronics is rapidly moving through the process installation and qualification cycle. Their PCB manufacturing expertise, in combination with these advanced fabrication capabilities, strongly positions Calumet to support industry leaders as they face growing challenges with increasing density and frequency.
Averatek’s A-SAP is an advanced manufacturing process for printed circuit board fabrication with trace and space widths as narrow as 15 microns. This process can dramatically reduce the area, layer count, and weight of electronics systems as well as provide significant RF benefits. A-SAP has been designed to be easily integrated with traditional PCB manufacturing equipment and materials.
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