Latest PCB (Printed Circuit Board) News | Conformal Coatings | Page 3

Electrolube, a brand of MacDermid Alpha Electronics Solutions, will be showcasing new solutions from their extensive encapsulation resin, thermal management and conformal coating portfolios in Hall 14 stand PB55 at Productronica India, held on the 21st-23rd September at the India Expo Mart in Greate... Read More

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Wednesday, August 24, 2022 at the Best Western Plus Strongsville. The KYZEN team will showcase the first and only concentration mo... Read More

Electrolube, a brand of MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly, and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, has formulated a Conformal Coating (FPC) specifically to re... Read More

Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will showcase the latest dispensing, conformal coating, and selective soldering equipment for printed circuit board assembly in two stands at the SMTConnect trade fair in Nuremberg, Germany, May 10-12, 2022.In ... Read More

YINCAE, a leading manufacturer and supplier of high-performance coatings, adhesives, and electronic materials, has announced that it has developed DA 158N die-attach materials which are thermally conductive and electrical insulating adhesives. It can be fast cured at low temperatures and can be used... Read More

PVA, a global supplier of automated dispensing and coating equipment, has received a new patent for its optical bonding software in Europe. The patent is for the United Kingdom, France, Italy, Germany, Hungary, Portugal and Spain.Jon Urquhart, Director of Applications Engineering, said: “This ... Read More

Essentium Inc., a leading innovator of industrial additive manufacturing (AM) solutions, at the AMUG 2021 (Additive Manufacturing Users Group) Conference, has showcased how its work with partners and customers, including Mercury Systems and Rolls-Royce, is advancing AM in the aerospace and defense s... Read More

High Density Packaging (HDP) User Group has announced that Nippon Denkai has become its newest member. Nippon Denkai develops and produce ultrathin, high ductility copper foils for fine pitch wirings and substrate resins in the semiconductor industry. “Nippon Denkai is excited to be a member o... Read More