HDP User Group Announces Nippon Denkai Membership

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High Density Packaging (HDP) User Group has announced that Nippon Denkai has become its newest member. Nippon Denkai develops and produce ultrathin, high ductility copper foils for fine pitch wirings and substrate resins in the semiconductor industry. “Nippon Denkai is excited to be a member of the HDP User Group. We look forward to learning from our member partners through the collaborative problem solving approach fostered by the HDP team. By contributing our knowledge in copper foils, we believe that our participation will assist in projects related to printed circuit board processing, reliability, and signal integrity,” said Michael Coll, COO at Denkai America.

HDP User Group is a non-profit trade organization that offers memberships to companies involved in the supply chain of manufacturing products that utilize high-density electronic packages. “It is an honor and a privilege to have Nippon Denkai join the outstanding companies working on HDP User Group projects. Their expertise and capability in copper foil manufacturing will contribute significantly to several of our projects, such as our copper surface vs loss project, which is focused on high-speed signal integrity,” said Larry Marcanti, Executive Director of HDP User Group.