Technological upheavals such as self-driving cars and the increasing importance of data centers are driving the demand for high-performance computer chips to unimagined heights. AT&S benefits from this development through its leadership position in the manufacture of substrates, without which no... Read More
Cadence Design Systems has announced that it is working with TSMC to accelerate 3D-IC multi-chiplet design innovation. As part of the collaboration, the Cadence® Integrity™ 3D-IC platform is enabled for TSMC 3DFabric™ technologies. Cadence® Integrity™ 3D-IC platform is the ... Read More
SEMI, the global industry association representing more than 2,400 semiconductor and electronics manufacturing companies worldwide, applauded the proposed European Chips Act legislation aimed at strengthening semiconductor research, development, and manufacturing in Europe.Proposed by European Commi... Read More
Moore’s Law, the famous prediction that the number of transistors that can be packed onto a microchip will double every couple of years, has been bumping into basic physical limits. These limits could bring decades of progress to a halt, unless new approaches are found. One new direction being... Read More
In recent years, researchers have seemingly hit the limit on how far smaller microchips used in our day-to-day devices can shrink, so as to provide a much more enhanced experience. One of the biggest hurdles to putting more circuits and power onto a smaller chip is managing the heat. As chips become... Read More
Vishay Intertechnology Inc has introduced a new series of AEC-Q200 qualified high voltage thick film chip resistors. Offering working voltages to 3000 V, stability of 1.0 %, and power ratings up to 1.0 W, the Vishay Techno CRHA Series is available in five compact case sizes ranging from 1206 to 2512... Read More
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