TR7007 SII Ultra DL

TR7007 SII Ultra DL

Solder Paste Inspection Equipment by Test Research, Inc (21 more products)
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Product Specifications

Product Details

  • Part Number
    TR7007 SII Ultra DL
  • Manufacturer
    Test Research, Inc

General Parameters

  • Field of View
    4 Mpix@ 10 µm: 20 x 20, 4 Mpix@ 15 µm: 30 x 30 mm
  • Defects
    Insufficient Paste, Excessive Paste, Shape Deformity, Missing Paste, Bridge
  • Measurement
    Height, Area, Volume, Offset
  • PCB Size
    510 x 310 to 510 x 590 mm
  • PCB Thickness
    0.6-5 mm
  • PCB Weight
    3 kg
  • Imaging Method
    Dynamic Imaging
  • Imaging Resolution
    10 or 15 µm
  • Imaging Speed
    4 Mpix@ 10 µm: 80, 4 Mpix@ 15 µm: 180 cm²/sec
  • Height Resolution
    0.4 µm
  • Camera
    4 Mpix
  • 3D Technology
    2-way Fringe Pattern
  • Top Clearance
    50 mm
  • Bottom Clearance
    40 mm
  • Edge Clearance
    3 mm
  • Conveyor Height
    880 – 920 mm
  • Max. Solder Height
    10 µm: 420, 15 µm: 385 µm
  • Lighting
    RGB LED
  • X-Y Axis Resolution
    0.5 μm
  • Z-Axis Resolution
    1 µm
  • Net Weight
    925 kg
  • Overall Dimensions
    1100 x 1705 x 1600 mm

Technical Documents
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