Note: Your request will be directed to Test Research, Inc
The TR7007Q Plus from TRI Innovation is a 3D Solder Paste Inspection (SPI) machine that offers accurate inspection for low solder bridges and is capable of eliminating local PCB deformation by compensating board warpage. It is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. To ensure shadow-free inspection it is further equipped with up to 4 projectors. It further facilitates data exchange between the production line and the MES to enable data traceability for the connected factory. For higher uniformity inspection it is equipped with 2D lighting. It follows Stop-and-Go imaging method with camera resolutions of 4 MP or 12 MP.
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