TR7007 SII

The TR7007 SII Test Research, Inc. is a 3D Solder Paste Inspection Equipment that supports 2-way fringe pattern 3D technology. It has a 4 MP dynamic imaging camera with an imaging resolution of 10 or 15 µm and an imaging speed of 80 cm²/sec (10 µm) & 180 cm²/sec (15 µm). This equipment has a field of view of up to 30 x 30 mm and can measure solder heights up to 600 µm. It can accommodate PCBs with dimensions of up to 510 x 460 mm and a PCB thickness from 0.6 to 5 mm. This inline shadow-free solder paste inspection solution has a linear motor X-Y table for vibration-free accurate inspection. It has a dual-lane configuration, closed-loop function, enhanced 2D imaging & auto-warp compensation features. This equipment can measure various parameters such as height, area, volume & offset and can detect insufficient paste, excessive paste, shape deformity, missing paste & bridging defects. It has a footprint of 1220 x 1663 x 1620 mm.