PowerSpector S2 SPI

The PowerSpector S2 SPI from MEK Americas is a 3D Solder Paste Inspection Equipment. It can accommodate PCBs measuring up to 510 x 460 mm with thicknesses varying from 0.3 to 4 mm. This machine uses a multi-colour lighting system and features a camera system that uses a patented 5D sensor and high-grade telecentric lens. It can detect components as small as 01005 chip with an inspection speed of up to 9300 sq. mm/second (18/9-micron lens). This inspection machine employs a conveyor system with a conveyor height from 830 to 970 mm and automatic width adjustment. It can perform accurate and precise measurements of the solder pad height reference level including warped PCB’s with true colour reference extraction. 

The PowerSpector S2 SPI employs highly accurate 3D imaging for precise PCB solder paste analysis. It utilizes true colour 2D imaging which allows Intelligent Zero referencing and removes silk-screen from triggering false defects on bridging and volume detection. This inspection machine combines 2D and 3D measurements, addressing critical parameters like offset, smearing, shape, and bridging in dimensions X, Y, and Z. It supports fast and simple programming using Stencil Gerber and CAD data. The machine is available in an enclosure that measures 1100 x 1200 x 2080 mm, requires an AC supply, and weighs around 400 kg.