KY8080-M

KY8080-M

Solder Paste Inspection Equipment by Koh Young America, Inc (9 more products)
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Product Specifications

Product Details

  • Part Number
    KY8080-M
  • Manufacturer
    Koh Young America, Inc

General Parameters

  • Field of View
    30 x 30 mm
  • Defects
    Offset, Bridge, Volume, Offset, Shape Deformity, Insufficient Paste, Excessive Paste, Coplanarity
  • PCB Size
    350 x 330 mm, 350 x 580 mm
  • PCB Thickness
    0.4 to 4 mm
  • PCB Weight
    3 kg
  • Imaging Speed
    22.5 to 38.1 cm2/sec
  • Height Resolution
    1 μm
  • Camera
    4 MP
  • X-Y Axis Resolution
    15 µm, 20 µm
  • Net Weight
    500 kg, 550 kg
  • Overall Dimensions
    800 x 1335 x 1627 mm
  • Note :
    Single Lane, Dual Lane

Technical Documents
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