TR7007D SII

TR7007D SII

Solder Paste Inspection Equipment by Test Research, Inc (21 more products)
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Product Specifications

Product Details

  • Part Number
    TR7007D SII
  • Manufacturer
    Test Research, Inc

General Parameters

  • Field of View
    50.30 x 40.24 mm
  • Defects
    Insufficient Paste, Excessive Paste, Shape Deformity, Bridge
  • Measurement
    Height, Area, Volume, Offset
  • PCB Size
    510 x 460 mm
  • PCB Thickness
    0.6 to 5 mm
  • PCB Weight
    3 kg
  • Imaging Method
    Stop-and-Go Imaging
  • Imaging Resolution
    9.8 μm
  • Imaging Speed
    Up to 2.6 FOV/sec
  • Height Resolution
    0.4 μm
  • Camera
    21 MP
  • 3D Technology
    2-way Digital Fringe Pattern
  • Top Clearance
    25 mm
  • Bottom Clearance
    40 mm
  • Edge Clearance
    3 mm
  • Conveyor Height
    880 to 920 mm
  • Max. Solder Height
    420 μm
  • Lighting
    Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting
  • X-Y Axis Resolution
    1 μm
  • Z-Axis Resolution
    1 μm
  • Net Weight
    795 kg
  • Overall Dimensions
    1000 x 1480 x 1650 mm

Technical Documents
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