TR7007LQ Plus

TR7007LQ Plus

Solder Paste Inspection Equipment by Test Research, Inc (21 more products)
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Product Specifications

Product Details

  • Part Number
    TR7007LQ Plus
  • Manufacturer
    Test Research, Inc

General Parameters

  • Field of View
    4 MP @ 10 μm: 20.3x20.3, @ 15 μm: 30.5x30.5 mm, 12 MP @ 5.5 μm: 22.5x16.5, @ 10 μm: 40.8x30.7, @ 15 μm: 61.2x46.1 mm,12 MP CoaXPress @ 6 μm: 24.4x18.4, @ 10 μm: 40.8x30.7 mm
  • Defects
    Insufficient Paste, Excessive Paste, Shape Deformity, Missing Paste, Bridge
  • Measurement
    Height, Area, Volume, Offset
  • PCB Size
    765 x 610 mm
  • PCB Thickness
    0.6 - 5 mm
  • PCB Weight
    3, 5 kg
  • Imaging Method
    Stop-and-Go Imaging
  • Imaging Resolution
    5.5, 6, 10 , 15 µm
  • Imaging Speed
    4 MP - Up to 3, 12 MP : Up to 1.8, 12 MP CoaXPress: Up to 2.6 FOV/sec
  • Height Resolution
    10 μm/15 μm: 0.45, 5.5 μm/6 μm: 0.22 μm
  • Camera
    4 Mpix or 12 Mpix (factory setting)
  • 3D Technology
    4-way Digital Fringe Pattern
  • Top Clearance
    25, 50 mm
  • Bottom Clearance
    40 mm
  • Edge Clearance
    3 mm
  • Conveyor Height
    880 – 920 mm
  • Max. Solder Height
    10 μm/15 μm: 420 μm/750, 5.5 μm/6 μm: 210 μm/310 μm
  • Lighting
    Enhanced 2D Lights (RGB+W)
  • X-Y Axis Resolution
    0.5 μm
  • Z-Axis Resolution
    1 µm
  • Net Weight
    982 kg
  • Overall Dimensions
    1365 x 1720 x 1710 mm

Technical Documents
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