SE3000-D

SE3000-D

Solder Paste Inspection Equipment by CyberOptics Corporation (8 more products)
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Product Specifications

Product Details

  • Part Number
    SE3000-D
  • Manufacturer
    CyberOptics Corporation

General Parameters

  • Field of View
    36 x 36 mm
  • Measurement
    Height, Bridge, Area, Volume
  • PCB Size
    510 x 510 mm, 350 x 320 mm
  • PCB Thickness
    0.3 to 5 mm
  • PCB Weight
    3 Kg
  • Imaging Method
    Multi-3D sensors
  • Imaging Resolution
    18 µm
  • Imaging Speed
    35 cm2 /sec
  • 3D Technology
    MRS Technology
  • Top Clearance
    50 mm
  • Bottom Clearance
    30 mm
  • Edge Clearance
    3 mm
  • Net Weight
    1596 kg
  • Overall Dimensions
    1705 x 1620 x 1520 mm

Technical Documents
View more details on the manufacturer's website
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