AP500

The AP500 from ASC International is a 3D Solder Paste Inspection (SPI) Equipment that uses Phase Shift Interferometry (PSI) for measurement. It has a camera with a resolution of 1280 x 1024 pixels, a lateral resolution of 1.78 μm, and a field of view of 8.7 x 6.2 mm. This SPI machine has a white LED for illumination and can generate inspection results in just one second.    

The AP500 SPI system can accommodate PCB sizes up to 51 x 51 cm and a PCB thickness of up to 5.1 cm. It can measure height, volume, area, width, length & displacement and perform 3D defect analysis. This SPI equipment requires an AC supply of 100-240 V and has a footprint of 30 x 26 x 16.5 inches. It is ideal for solder paste, adhesives, thick films, grease, etc. measurement applications.