Latest PCB (Printed Circuit Board) News | Global | Page 9

Carol Handwerker’s life’s work is aimed at increasing reliability in everything from the largest Navy carrier to the family car. She does it by researching probably the most inconspicuous material: solder. Handwerker, the Reinhardt Schuhmann Jr. Professor of Materials Engineering at Purd... Read More

YINCAE Advanced Materials announced that their company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category. This ceremony took place on Wednesday, November 2nd at SMTAI 2022 Exhibition in Minneapolis, USA.YINCAE’s die attach material was recogni... Read More

Plexus announced its position as a founding member of the Semiconductor Climate Consortium (SCC). This newly formed group, supported by SEMI, a leading industry association representing the electronics manufacturing and design supply chain, was created to accelerate the reduction of greenhouse gas e... Read More

Nordson Corporation has completed the acquisition of CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D optical sensing technology solutions. The completion of the transaction follows the Company’s August 8, 2022, announcement that it had entered into an ... Read More

ViTrox Technologies announces that their V510i Advanced 3D Optical Inspection (AOI) Solution has successfully passed the qualification audit for IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification.The implementation of the IPC-CFX on a sho... Read More

X2F is making waves with their breakthrough molding technology, unlocking new manufacturing capabilities for protecting electronics from heat. X2F’s unique technology molds highly filled and extremely viscous materials that are “impossible to mold” with today’s conventional a... Read More

Isola Group is coming to Munich, Germany and Electronica 2022 with an assortment of circuit materials expected to meet or exceed the needs of the broad range of markets the international event serves. Set for November 15-18, 2022 in the Trade Fair Center, Messe Munchen, Electronica 2022 is the world... Read More

Cadence Design Systems, announced the leading Cadence® Integrity™ 3D-IC platform has achieved certification for and met all reference design flow criteria for TSMC’s 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-... Read More

ICAPE Group, a global technology distributor of printed circuit boards, announced the appointment of Christelle Bonnevie as Chief Industrial Officer (CIO).ICAPE Group continues to implement its global expansion strategy with the appointment of Christelle Bonnevie as Deputy Chief Executive Officer al... Read More

Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announced the launch of a new model of in-line 3D-CT automated X-ray inspection system (AXI) for power module inspection. The 3Xi-M200 V2 significantly reduces cycle time while improving inspection image... Read More

Singapore-based Excelpoint Systems (“Excelpoint”), a leading regional B-to-B business platform providing quality electronics components with integrated R&D capabilities, and Bkav Hardware Solution (“BHS”), a member of Vietnam-based Bkav Corporation (“Bkav”) th... Read More

Isola Asia will be well represented by its circuit material experts at the 2022 Taiwan PCB & Assembly (TPCA) Show, as they advise attendees on the optimum uses of their materials for the growing numbers of high-frequency analog and high-speed-digital (HSD) electronic circuit applications. Isola&... Read More

Semtech Corporation, a leading global supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, announced the release of the HotSwitch® platform. This platform includes integrated load switches and eFuses with first-of-their-kind elevated protection feature set... Read More

Indium Corporation Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, will be part of a panel presentation at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference in Taipei, Taiwan on October 27. The presentation will cover... Read More

Molex, a leading global electronics leader and connectivity innovator, has announced the release of its NearStack PCIe Connector System and Cable Assemblies for next-gen servers. Developed in collaboration with members of the Open Compute Project (OCP), NearStack PCIe replaces traditional paddle-car... Read More

According to a Comprehensive Research Report by Market Research Future (MRFR), “Copper Foil Market Information by Product, Form, Category, Distribution Channel, and Region - Forecast till 2030”, the market is estimated to grow at a 10.31% CAGR to reach USD 17,321.8 Million by 2030. ... Read More

CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Europa 2022, scheduled to take place November 15-18, 2022 at the Messe Munchen in Munich, Germany. The company will feature its next-generation WaferSense&r... Read More

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission are gathering in Washington, D.C. this week to discuss "the next big thing" in CHIPS Act implementation: expanding "advanced packaging"... Read More

Space Tech Expo Europe 2022, now in its fifth year, is scheduled to take place from November 15-17 in Bremen, Germany. It is Europe's largest B2B space event and is focused on manufacturing, designing, testing and engineering services for spacecraft, subsystems and space-qualified components.&nb... Read More

Sanmina Corporation, a leading integrated manufacturing solutions company and Reliance Strategic Business Ventures Limited (RSBVL), a wholly-owned subsidiary of Reliance Industries Limited (RIL), India's largest private sector company, announced they have completed the previously announced joint... Read More