Latest PCB (Printed Circuit Board) News | Flex | Page 4

Flex announced the opening of its third Global Business Services (GBS) center in Coimbatore, India. This GBS center will complement its existing GBS facilities in Chennai and Pune.“Our Global Business Services and Solutions has evolved to be an integral part of Flex operations with resilient b... Read More

Peters, a leading manufacturer of soldering materials, has announced the release of its latest product: Elpemer solder resist SD 2463 FLEX-HF. This high-quality resist is designed for use on flexible electronic circuit carriers, such as rigid-flex and semi-flex PCBs. Available in transparent green a... Read More

Indium Corporation has added SiPaste® C201HF to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components. SiPaste® C201HF combines superior, indust... Read More

Research and Market have added the "Global Flexible Electronics Market Research and Forecast 2022-2028" report to their offering. According to this report, the global flexible electronics market is anticipated to grow at a significant CAGR of 15.8% during the forecast period.The Report Cov... Read More

IDTechEx released a report titled “Sustainable Electronics Manufacturing 2023-2033" which explores the key opportunities for sustainable innovation and the most promising new manufacturing approaches. The report concentrates on the fundamental building blocks of electronics – printe... Read More

Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at IPC APEX EXPO 2023 in San Diego, CA. Visitors are invited to speak with the Saki team in Booth #2475 from January 24 – 26 where Saki’s world-leading inspection mach... Read More

HARTING, a producer of mechatronic components for medical technology, automotive, industrial and consumer electronics, is offering 3D-Circuits technology which allows the 3D-MID parts or the injection-molded thermoplastic part to be directly integrated with electronic circuits and components. This m... Read More

Sensepeek, a leading Swedish R&D company with an engineering focus on Mechanical, Software, and Hardware solutions for PCBs, has introduces the PCBite Solution for hands-free inspection. PCBite is a complete line of products handling your circuit board during the development phase and consists o... Read More

Research and Markets have added the "Global Flexible Printed Circuit Board Market - Forecasts from 2022 to 2027" report to their offering. According to this report, the market is expected to surge in the coming years due to the rising use of flexible printed circuit boards in consumer elec... Read More

Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. The work paves the way for a variety of new soft electronic technologies, and researchers have used the technique to create prototype &ldq... Read More

With applications ranging from energy harvesting to sensing, and applicability to sectors as varied as healthcare and automotive, printed/flexible electronics are set to change expectations of what electronics can provide and where they can be utilized. This is not just a technology for the future: ... Read More

With COP27 underway, sustainability is once again at the forefront of the global discussion. Debates surrounding emissions reductions, water security, and renewable energy are at center stage with many politicians, businesses, investors, and think tanks enthusiastic to bring about meaningful change.... Read More

Voltera, a global leader and manufacturer of additive and printed electronics technology, has announced the launch of NOVA, a groundbreaking manufacturing platform for printing flexible hybrid electronics. NOVA uses direct-write technology to print circuits on soft, stretchable, and conformable surf... Read More

According to a Comprehensive Research Report by Market Research Future (MRFR), “Copper Foil Market Information by Product, Form, Category, Distribution Channel, and Region - Forecast till 2030”, the market is estimated to grow at a 10.31% CAGR to reach USD 17,321.8 Million by 2030. ... Read More

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has released the industry’s first automotive-qualified multilayer varistors (MLVs) equipped with the company’s patented FLEXITERM®... Read More

Nortech Systems, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical, industrial and defense markets, announced this week that the US Patent Office has issued Patent No. 11,412,608, for the Company's Flex Far... Read More

Ventec announced the introduction of tec-speed 4.0 (VT-462(L) PP NF/LF), a next-generation no & low flow FR 4.0 prepreg material. Adding to their range of flex-rigid No Flow / Low Flow prepregs, tec-speed 4.0 (VT-462(L) PP NF/LF) offers high-Tg, low Dk, low loss, and excellent thermal reliabilit... Read More

Summit Interconnect has announced the acquisition of Royal Circuit Solutions with California operations in Hollister and Santa Ana and affiliate Advanced Assembly located in Aurora, Colorado. The acquisition expands Summit’s PCB offering in rigid, flex, rigid/flex and ATE PCBs, significantly s... Read More

Universal Instruments held a ribbon-cutting ceremony for Binghamton University’s acceptance of the company’s High-Speed Wafer Feeder (HSWF) on April 5 at Universal’s corporate headquarters in Conklin, NY. The ceremony included representatives from Universal, Binghamton University a... Read More

NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, announced that it has generated $17 million in funding (including $8.7M in cost-share contribution from participants) for 18 new projects as part of its Project Call 6.0 to further promote FHE development and a... Read More