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Indium Corporation has added SiPaste® C201HF to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.
SiPaste® C201HF combines superior, industry-leading non-wet open (NWO) performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. It leaves behind a cleanable residue, able to be removed with a commercially available semi-aqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not applicable. SiPaste® C201HF features excellent transfer efficiency on fine feature apertures, with consistent process yields below 80μm.
SiPaste® C201HF delivers:
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