The PCB EAST 2023, one of the most significant events in the PCB supply chain, is set to take place from May 9-12, 2023, and will be hosted in Boxborough, Massachusetts. The four-day technical event including a one-day exhibition on 10th May 2023 will offer extensive training to designers, engineers... Read More
Based in France, the iCape Group is a leading manufacturer of PCBs that are used in a wide range of applications, including automotive, medical, aerospace, and telecommunications industries. The company's expertise in PCB design and production has made it a trusted partner for many businesses.Th... Read More
NCAB Group, a leading manufacturer of Printed Circuit Boards (PCBs), is playing a crucial role in the transformation of civilian air traffic. As the industry shifts towards long-term sustainability goals, there is a need for more fuel-efficient powertrains and increased efficiency. At the same time,... Read More
Sunshine Global Circuits (SGC) has announced the acquisition of Vision Industries in Penang, Malaysia. This acquisition is seen as an important step to extend Sunshine’s manufacturing capabilities into Southeast Asia and will enhance SGC's product offerings in microwave and RF circuit boar... Read More
KYZEN will exhibit at the SMTA Atlanta Expo & Tech Forum 2023, scheduled to take place on Wednesday, April 26, 2023 at the Atlanta Tech Park. The KYZEN team will discuss the KYZEN ANALYST real-time, automatic concentration analytics system designed for all chemistries and AQUANOX A4626 aqueous s... Read More
IPC's Validation Services Program has recently requalified Fabrication Technologies/IGM Solutions (FabTech-IGM) for its IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML). FabTech-IGM is a leading vertically integrated contract manufacturer of electronic components and high-level ... Read More
Pro-Active Engineering, a leading provider of electronic design and engineering services, has made a significant investment in cutting-edge technology to better serve its customers and installed the "NIKON XT V 160 X-ray machine" at its state-of-the-art facility in Sun Prairie, WI. With th... Read More
ReportLinker announced the launch of “Prepreg Global Market Report 2023” which provides prepreg market statistics, including prepreg industry global market size, regional shares, competitors with a prepreg market share, detailed prepreg market segments, market trends, and opportunities, ... Read More
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its more than 3,200 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly, and test... Read More
Dymax, a leading manufacturer of rapid-curing materials and equipment, announced the release of 1045-M adhesive, the newest product in its renowned line of MD light-curable materials for medical device assembly.The product is designed to bond the glass, SS, ABS, and PC substrates used to assemble pr... Read More
Duke University's engineers have produced the world’s first fully recyclable printed electronics that replace the use of chemicals with water in the fabrication process. By bypassing the need for hazardous chemicals, the demonstration points down a path industry could follow to reduce its ... Read More
Cadence Design Systems announced the Cadence Allegro X AI technology, a next-generation system design technology that offers revolutionary improvements in performance and automation. The new AI offering is built on and accessed through the Allegro X Design Platform. It offers transformative time sav... Read More
MacDermid Alpha has expanded the Argomax® technology offering. Argomax® 2148 is a new silver sintering product, designed for electric vehicle power inverters. The sintered joint enables the fabrication of smaller, lighter, and reliable power train systems. MacDermid Alpha’s range ... Read More
Kyocera announced that it has reached an agreement to acquire about 37 acres of land for a new smart factory at the Minami Isahaya Industrial Park in Isahaya City, Nagasaki Prefecture. A signing ceremony held at New Nagasaki Hotel was attended by Kyocera Corporation President Hideo Tanimoto, as well... Read More
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning, and solderability test equipment, announces that it has published a technical paper describing the suggestion that electronic manufacturers should implement automated selective soldering as opposed to usin... Read More
Indium will showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market, including cutting-edge high-reliability alloys, at productronica China, April 13-15, in Shanghai. Indium Corporation will feature its Rel-ion™ suite of elec... Read More
IPC welcomes the action of U.S. President Joe Biden in issuing a “presidential determination” that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA). IPC, al... Read More
Prototron Circuits' President, Mr. Dave Ryder, has announced the signing of Jack Lorber of Sourcing Specialist to represent his company in the Northeast USA.“We are very glad to have Jack Lorber join the Prototron sales team. His knowledge and experience in sales and sourcing will go a lon... Read More
Tempo Automation announced that it has entered into a definitive agreement to acquire Optimum, Inc. and Optimum Design. By vertically integrating electronic design and manufacturing, Tempo expects to be able to engage with customers even earlier in their product design process, streamlining the hard... Read More
YINCAE announced the release of its new breakthrough product: Thermal Underfill- UF 158A2. It is ideal for use in high-reliability applications where temperature cycling, shock, and vibration can cause damage to electronic components. The product features excellent thermal conductivity and high-temp... Read More
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