IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its more than 3,200 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly, and testing. IPC just recently applauded the new U.S.-Canada Partnership to Strengthen the Packaging and Manufacturing of Printed Circuit Board in North America.https://cdn.pcbdirectory.com/news/US_CANADA_638167916746085182.jpeg712370
The following is a statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S. President Joe Biden and Canadian Prime Minister Justin Trudeau:
“On behalf of electronics manufacturers, IPC applauds the just-announced partnership between the United States and Canada ‘to strengthen advanced packaging for semiconductors and printed circuit boards in North America,’ including an additional USD $50 million in U.S. Defense Production Act funding for those purposes.” He further stated, “In order to achieve their shared goals, the U.S. and Canada must invest in and support the growth of the electronics manufacturing ecosystem, including printed circuit boards (PCBs), IC substrates, and semiconductor assembly. Neglecting a “silicon-to-systems” approach would undercut the promise of the CHIPS Act and the region’s long-term leadership in innovation. Today’s announcement represents another meaningful step toward rebuilding a North American electronics manufacturing industry that was once the envy of the world.
This is the third time in a month that the U.S. Government has called for a “more than just chips” approach to implementing the CHIPS Act. On Feb. 23, Commerce Secretary Gina Raimondo said the government is working to establish at least two new, large-scale clusters of leading-edge semiconductor fabs, each with a robust supplier ecosystem, cutting-edge R&D, and workforce training. Significantly, she said the U.S. will develop multiple high-volume “advanced packaging” facilities and become a global leader in chip packaging technologies.
The week before, on a Freakonomics podcast, Raimondo confirmed that some CHIPS Act funding will go to “smaller firms,” including “circuit-board companies.”
Following are additional IPC resources on this issue:
Click here to read the full letter on the use of DPA.
Click here to read IPC's report on Rebuilding the U.S. supply chain.
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