Note: Your request will be directed to KOKI Company Ltd
The S3X58-HF1100-3 by KOKI Company Ltd. is a halogen-free and lead-free solder paste. It features a no-clean flux type, Sn3.0Ag0.5Cu alloy composition, and a particle size of 20-38/10-25um. The solder paste has a melting point range of 217 to 219 Degrees C. It comes in a jar package and the flux content is 11-12%. The S3X58-HF1100-3 has a ROL0 flux type and viscosity of 190 Pa.s. Its flux formulation enhances coagulation during melting, reducing voiding rate, and flux splattering and improves wetting.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
Create an account on PCB-Directory to claim your profile.
