NC259FPA

The NC259FPA from AIM Metals & Alloys is an Ultrafine Lead-free Solder Paste that is composed of an alloy of Tin (96.5%), Copper (0.5%), and Silver (3%). It uses a no-clean flux, which helps in ensuring a clean flux residue during the soldering process. This paste has an optimum melting point from 217°C to 220°C. It is designed for Type 6 and finer solder powders and ensures precise print definition and efficient transfer rates. With its activator system, this solder paste facilitates wetting on diverse surface finishes, leading to shear strength values of up to 150 gf. The paste leaves behind a clear flux residue characterized by high Surface Insulation Resistance (SIR) values. This solder paste is available in jars with a shelf life of 6 months and should be stored at a temperature of 0 to 12°C.