TR7007Q SII

The TR7007Q SII from Test Research, Inc (TRI) is a Solder Paste Inspection Equipment. It uses a high-resolution camera system, that captures PCB details with its 21 MP and a 12-bit CMOS camera sensor that uses Stop-and-Go Imaging method to produce images of resolution of 9.8 μm. This machine has an inspection camera with a field of view is 50.30 x 40.24 mm and an imaging speed of up to 2.6 FOV/sec which reduces the inspection time. It uses wide spectrum 2D Lights (RGB+W) and optional coaxial lighting process, which alongside the 4-way digital fringe pattern 3D technology produces the excellent images. This machine can accommodate PCBs with dimension of up to 510 x 460 mm, thickness varying from 0.6 to 5 mm and weighing up to 3 Kgs.

The TR7007Q SII supports multiple conveying directions (Left to right, right to left, left to left, right to right) and provides automatic conveyor width adjustment. It has a height resolution of 0.4 μm and a maximum solder height detection capability of 420 μm to ensure thorough examination even in intricate PCB assemblies. The equipment’s X-Y axis resolution of 1 μm and Z-axis resolution of 1 μm further enhance its ability to capture minute variations. It is equipped with EtherCAT motion controller which enables real-time measurements and provides 100% shadow-free quad/dual digital fringe projectors and SmartWarp compensation to eliminate local PCB deformation.

The TR7007Q SII is available in a housing that measures 1000 x 1480 x 1650 mm, while the weight of the model is 795 kg. It is an Industry 4.0 Ready solution with support for industry-standard protocols like IPC Connected Factory Exchange (CFX) and IPC Hermes 9852.