TR7007DI Plus

TR7007DI Plus

Solder Paste Inspection Equipment by Test Research, Inc (20 more products)
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Product Specifications

Product Details

  • Part Number
    TR7007DI Plus
  • Manufacturer
    Test Research, Inc

General Parameters

  • Field of View
    30.5 x 30.5 mm, 61 x 46 mm
  • Defects
    Insufficient Paste, Excessive Paste, Shape Deformity, Bridge
  • Measurement
    Height, Area, Volume, Offset
  • PCB Size
    510 x 460 mm
  • PCB Thickness
    0.6 to 5 mm
  • PCB Weight
    3, 5 kg
  • Imaging Method
    Stop-and-Go Imaging
  • Imaging Resolution
    5.5 μm, 6 μm, 10 μm , 15 µm
  • Imaging Speed
    3 FOV/sec, 1.8 FOV/sec, 2.6 FOV/sec
  • Height Resolution
    0.45 μm, 0.22 μm
  • Camera
    4 MP, 12 MP
  • 3D Technology
    2-way Digital Fringe Pattern
  • Top Clearance
    25 mm, 50 mm
  • Bottom Clearance
    40 mm
  • Edge Clearance
    3 mm
  • Conveyor Height
    880 to 920 mm
  • Max. Solder Height
    750 μm, 310 μm
  • Lighting
    Enhanced 2D Lights (RGB+W)
  • X-Y Axis Resolution
    0.5 μm
  • Z-Axis Resolution
    1 μm
  • Net Weight
    775 kg
  • Overall Dimensions
    1000 x 1360 x 1600 mm

Technical Documents
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