3Si-ZS2

The 3Si-ZS2 from Saki Corporation is a Solder Paste Inspection Equipment. It can accommodate PCBs measuring up to 686 x 870 mm and features a camera system that uses 3D imaging to inspect solder joints. This system produces images with a resolution from 7 to 18 µm and a height resolution of 500 µm. The top and bottom clearance for easy mobility of the camera is 40 mm and 60 mm, respectively. It analyzes various potential issues such as solder paste area, height, volume, and compliance with bridge, solder horn, and BGA coplanarity. The quality of the entire production line is ensured through machine-to-machine coordination with solder printing and pick-and-place machines. It has an industry-leading inspection speed for micro-component pads and innovative hardware structures coupled with comprehensive self-diagnostics. Additionally, Saki's M2M solution facilitates feedback from SPI to the screen printer and feed-forward from SPI to the pick-and-place machine.  

The 3Si-ZS2 is available in an enclosure that measures 1340 x 1440 x 1500 mm and requires an AC supply.