FX-500 ULTRA 3D SPI

FX-500 ULTRA 3D SPI

Solder Paste Inspection Equipment by Nordson YESTECH
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Product Specifications

Product Details

  • Part Number
    FX-500 ULTRA 3D SPI
  • Manufacturer
    Nordson YESTECH

General Parameters

  • Field of View
    32 x 32 mm
  • Measurement
    Height, Area, Volume, Registration, Bridge Detection, Defect Review
  • PCB Size
    20.0 x 19.8 in. (508 x 503 mm)
  • Height Resolution
    0.2 µm (0.008 mils)

Technical Documents
View more details on the manufacturer's website
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