TR7007 SIII

The TR7007 SIII from Test Research, Inc. is a 3D Solder Paste Inspection Equipment that supports 2-way fringe pattern 3D technology. It has a 4 MP dynamic imaging camera with an imaging resolution of 10 µm or 15 µm and an imaging speed of 90 cm²/sec (10 µm) and 200 cm²/sec (15 µm). This equipment has a field of view of 30 x 30 mm and can measure solder heights up to 400 µm. It can accommodate PCBs with dimensions of up to 510 x 460 mm and a PCB thickness from 0.6 to 5 mm. This Industry 4.0 ready solution has feedback and feedforward capabilities and supports various protocols such as IPC Connected Factory Exchange (CFX) and IPC Hermes 9852 standard. It can measure various parameters such as height, area, volume & offset and can detect insufficient paste, excessive paste, shape deformity, missing paste & bridging defects. This machine has a footprint of 1100 x 1480 x 1600 mm and is ideal for multiple industries like telecom, consumer electronics, etc.