Eagle Circuits Chosen to Conduct Reliability and Environmental Tests of Occam Solderless Assemblies

https://cdn.pcbdirectory.com/news/istockphoto_1468266144_612x612_638611975348017884.jpg712370

Eagle Circuits, a company based in Dallas, TX, has been chosen to lead a pivotal project aimed at transforming U.S. electronics manufacturing by building the first set of Occam test assemblies. This initiative, funded by the Department of Defense (DOD) Executive Agent in collaboration with the Naval Surface Warfare Center, Crane, will subject these assemblies to rigorous reliability and environmental tests, showcasing the potential of Occam’s innovative, solderless methodology over traditional assembly techniques.

“Occam component assemblies provide a giant leap forward for U.S. manufacturing,” said Ray Rasmussen, Occam's managing partner. “Using existing equipment, fabricators and their EMS partners can construct Occam assemblies today. Once companies give Occam a spin, they will begin to see the possibilities.” Eagle CEO, Nilesh Naik added, “In going through this process we began to see, what Ray calls, the Occam Opportunity for Eagle and the industry. The possibilities are almost endless. Instead of driving the industry to more complex configurations, Occam simplifies the process, allowing us to do much more with much less.”

Occam’s solderless methodology lowers cost while greatly improving reliability. It addresses many of the DOD's stated concerns regarding the reliability of electronic assemblies and provides a world-leading path forward for the domestic industry. Occam is homegrown, U.S.-based, highly reliable, and has thermal management, EMI/ESD, and security built-in. It greatly reduces the need for UHDI, giving the industry a pathway to achieve world-leading performance without the complexity.

Click here to learn more about Eagle Circuits.