MS-15

MS-15

Solder Paste Inspection Equipment by MIRTEC (5 more products)
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Product Specifications

Product Details

  • Part Number
    MS-15
  • Manufacturer
    MIRTEC

General Parameters

  • Measurement
    Height, Volume / Area, Solder Bridge, X/Y Offset, Shape Deformity
  • PCB Size
    50 x 50 to 460 x 510 mm
  • PCB Weight
    4 kg
  • Imaging Resolution
    15 µm
  • Height Resolution
    ±1 μm
  • Camera
    15 MP
  • 3D Technology
    Dual Projection Shadow Free Moiré Phase Step Image Processing
  • Bottom Clearance
    50 mm
  • Edge Clearance
    3 mm
  • Net Weight
    1200 Kg
  • Overall Dimensions
    1250 x 1500 x 1600 mm

Technical Documents
View more details on the manufacturer's website
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