VSP3000D

The VSP3000D from MagicRay Technology is a 3D Solder Paste Inspection (SPI) system that is ideal for use after SMT screen printing process. It has a 12 MP industrial camera with a resolution of 10, 12, and 15 µm, providing an effective field of view (FOV) of 60.45 mm (15 µm). The imaging system uses three-color ring-shaped LED lighting (RGB) for enhanced accuracy.

The VSP3000D features a granite platform with AC servo (dual drive) control for the X and Y axis controls, together with automatic width adjustment. It has a belt system for transport, and the board loading direction can be set to operate either left to right or right to left, depending on user preference. This SPI system can detect the Icicle, Insufficient Solder and Excess Solder, Average Height, Offset and Solder Bridge, Odd Shape, Exposed Copper, and Golder Finger defects using a cross-section algorithm with high precision. 

The VSP3000D SPI system handles various sizes of PCB ranging from 50 x 60 mm to 510 x 510 mm, depending on the configuration and can also inspect both single- and dual-lane PCBs. This SPI system has an inspection speed of 400-450 ms per FOV as standard performance to assure efficient production line integration. It has a footprint of 935 x 1360 x 1570 mm.