KY8030-3-L

KY8030-3-L

Solder Paste Inspection Equipment by Koh Young America, Inc (9 more products)
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Product Specifications

Product Details

  • Part Number
    KY8030-3-L
  • Manufacturer
    Koh Young America, Inc

General Parameters

  • Field of View
    47 x 34.6 mm
  • Defects
    Offset, Bridge, Volume, Offset, Shape Deformity, Insufficient Paste, Excessive Paste, Coplanarity
  • PCB Size
    510 x 510 mm
  • PCB Thickness
    0.4 to 5 mm
  • PCB Weight
    2 kg
  • Imaging Speed
    91.2 cm2/sec
  • Height Resolution
    1.5 μm
  • Camera
    4 MP
  • Bottom Clearance
    30 mm
  • X-Y Axis Resolution
    15 µm, 20 µm
  • Z-Axis Resolution
    0.37 µm
  • Net Weight
    550 kg
  • Overall Dimensions
    1203 x 907 x 1069 mm

Technical Documents
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